News
PEACHTREE CITY, GA – SEPTEMBER 4, 2025 – The Printed Circuit Engineering Association (PCEA) today announced Jackson Schultz, head of engineering at Rainmaker Technology, will keynote PCB West this fall.
MALAYSIA – Scanfil has officially inaugurated the expansion and modernization of its Johor Bahru facility in Malaysia, building its electronics and complex box-build manufacturing capabilities. The EUR 4.3 million investment, first announced in January, expands production space by nearly 50% and enhances efficiency, quality and capacity.
BENGALURU – Syrma SGS Technology has signed a joint venture agreement with Italy-based Elemaster to form Syrma SGS Elemaster Private Limited, an India-focused platform serving high-reliability customers in railway, industrial and medical electronics. The JV’s initial ~20,000 sq. ft. facility in Bommasandra Industrial Area, Bengaluru will be configured for SMT, THT and box-build assembly lines.
Press Releases
- NEDME Returns October 22 — The Northwest’s Premier Design & Manufacturing Expo
- CE3S and Desco Announce Upcoming ANSI/ESD S20.20-2021 Training Series for ESD Professionals
- ViTrox Americas Appoints ArgoZeta as Sales Partner for the Mid-Atlantic Region
- Altus Group Expands Service Team with Addition of Experienced Engineer