News
AUSTIN, TX – TechSearch International is projecting a 69% compound annual growth rate for packages using chiplet architectures from 2023 to 2029, according to its latest Advanced Packaging Update.
CHENNAI, INDIA – Syrma SGS Technology reported revenue of INR11.8 billion ($140.6 million) for the first quarter of its fiscal year, an increase of 92.9% from last year's first quarter.
OULU, FINLAND – Scanfil's second quarter sales of €195.5 million ($213.5 million) represented a decrease of 19.7% from last year's second quarter.
Press Releases
- SHENMAO Strengthens Semiconductor Capabilities with Acquisition of PMTC and Launch of New Low-Temperature Solder Alloy
- AIM Solder Appoints John Daniel Sawali as Sales Engineer Based in The Philippines
- Naprotek Appoints James Eisenhaure as Chief Financial Officer
- Naprotek Appoints James Eisenhaure as Chief Financial Officer