News
KIC (San Diego, CA), a thermal process development and control software provider, has announced that its national sales manager, Marybeth Allen, will speak on the thermal process of low temperature co-fired ceramic (LTCC) at the IMAPS Orange Chapter Dinner Meeting on Feb. 19, 2004.
The speech, "Hot Product In Control — LTCC's Thermal Process," will describe applications for the use of LTCC and explain how these applications are multiplying rapidly. Standard components and other modules for communications, biomedical and automotive are being manufactured in high volume. Most of the world's production is currently done in box furnaces, which could be a lengthy process, adding cost and limiting production throughput. An alternative is the production of these parts in conveyorized furnaces. Allen's speech will discuss the advantages and challenges of moving to a conveyorized firing process. It will also include furnace setup, optimization relative to tight process windows and continuous monitoring of the thermal process to eliminate defects.
Allen's expertise lies within the management of the thermal process. She has 20 years of experience in the electronics assembly industry covering surface mount, thick film and packaging. As Project Manager, she works with manufacturers of equipment and materials for board and package assembly for thermal processes. Additionally, she is a past chapter president of SMTA & IMAPS and has authored various industry papers.
For more information on the meeting, visit www.imaps.org/chapters/orange.htm.
Copyright 2004, UP Media Group. All rights reserved.
SofTech Inc. (Tewksbury, MA), a provider of design-through-manufacturing productivity solutions, and Cimmetry Systems (Cambrige, MA), a provider of visualization and collaboration solutions for the A/E/C, Engineering, Manufacturing and Electronics markets, have announced a partnership. SofTech will license Cimmetry's AutoVue visualization and collaboration technology for its ProductCenter product lifecycle management (PLM) solution.
Integration of the visualization technology will extend the collaboration capabilities of the PLM, enhancing the solution's document management, design integration, configuration control, change management and enterprise integration capabilities for optimizing product development. The PLM users will gain capabilities to view, markup and collaborate in real-time on native product data of virtually any type, including: 3-D CAD parts and assemblies, 2-D CAD drawings, EDA PCB/IC layouts and schematics, scanned and raster documents, vector files, office documents and graphics.
AutoVue allows users to view, markup and collaborate in real time on over 200 native formats including: CATIA, Pro/Engineer, Unigraphics, SolidWorks, Inventor, Solid Edge, JT, AutoCAD, MicroStation, Mechanical Desktop, Cadence Allegro, Mentor Board Station, Orcad, PADS, Microsoft Office, Visio, PDF and TIFF. It is available as a Windows desktop application or a thin-client server based solution.
Copyright 2004, UP Media Group. All rights reserved.
Universal Instruments Corp. (UIC, Binghamton, NY) announced recently that it has established requisites for a long-term partnership with Shanghai, China-based DaimlerChryslerSIM Technology (DCSIM Tech.). DCSIM Tech. is a joint venture between DaimlerChrysler and Shanghai Institute of Microsystem and Information Technology.
According to UIC, the objective is to build local expertise in advanced electronics packaging. The two companies will invest in China's future in these technologies by training engineers, working with local suppliers, increasing local infrastructure and supporting local company projects for first- and second-level packaging.
"Our vision is to build an industry capable of servicing local Chinese component manufacturers and assemblers as well as export markets throughout Asia and worldwide," said Richard Boulanger of UIC's SMT Laboratory. "Both businesses will invest substantial resources to nurture local technical expertise and enhance the local infrastructure in Shanghai and Suzhou."
"Both companies are well positioned to develop China's high-tech electronics industry," stated Dr. Xiaoming Xie of DCSIM Tech. "As one of the major players on the local market for many years, I am pleased that this agreement has established long term objectives, as a high level of ongoing commitment is the only truly effective way to establish China as a global center of excellence."
Under the draft terms, UIC—with laboratories in Binghamton and Suzhou, China—will also help sponsor a student from DCSIM Tech. to join the electronics packaging program at Binghamton University. DCSIM Tech. will offer students and other resources such as failure analysis and reliability testing for specific Universal projects.
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