News
Cookson Electronics Assembly Materials (Jersey City, NJ) is launching a new ALPHA Cored Wire product series using Cookson's manufacturing methods to create consistent flux cores, assuring repeatability with a Cpk rating of 1.826. Available in 10 tin-lead and lead-free alloys, the new cored wire complies with J-STD-004, IPC-SF 818 and ISO 12224 and is offered in the following ALPHA brands: SMT Plus, Reliacore 15, Telecore Plus, Cleanline 7000, Energized Plus and Pure Core.
Cookson Electronics developed a layer winding process that ensures consistent smooth pay-out for manual and automatic solder rework. In addition, special attention was paid to packaging the new core wire line. New color-coded spools make identification of the flux chemistry easy, and thick flanges help reduce the risk of wire damage during transit. New color-coded labels also assist with product identification by flux type and alloy, and shrink-wrapping of the spools keeps the wire shiny and clean in transit and during storage.
Cookson EAM, a Cookson Electronics company, supplies a full line of solder paste, stencils, squeegee blades, stencil and printed circuit board cleaners, bar solder, cored wire solder, wave soldering fluxes and surface-mount device adhesives.
Copyright 2004, UP Media Group. All rights reserved.
The National Electronics Manufacturing Initiative (NEMI, Herndon, VA), an industry-led consortium focused on strengthening the global electronics manufacturing supply chain, is celebrating the tenth anniversary of its electronics manufacturing roadmap with a special banquet the evening of June 22 at NEMI headquarters. Featured speakers are Mauro Walker, chairman emeritus of NEMI, speaking on the NEMI legacy, and Dr. Iwona Turlik, corporate vice president for Motorola and director of the company's Physical Realization Research Center, who will discuss innovation through nanotechnology.
Walker was instrumental in the organization of NEMI and served as the consortium's founding chairman. He retired from Motorola in 1998, where he was senior vice president and director of manufacturing. Walker has had a long career of accomplishment in the advancement of electronic manufacturing and manufacturing technology in industry, academia and professional societies. He has testified before the U.S. Congress on the topic of U.S. manufacturing competitiveness. He is a recipient of the Institute of Electrical and Electronic Engineers' (IEEE's) Special Manufacturing Technology Award and the Society for Manufacturing Engineers' (SME's) Total Excellence in Electronic Manufacturing Award. Walker is an IEEE fellow and founder of the IEEE International Manufacturing Technology Symposium. He was instrumental in the formation of the MIT Leaders for Manufacturing program as well the Georgia Tech and University of Illinois Manufacturing Research Centers.
Turlik has worked in the electronics industry and academia for more than two decades. She has been with Motorola since 1994 and was previously director of Motorola's Corporate Manufacturing Research Center. Turlik received her M.S. degree in electrical engineering and her Ph.D. in technical science from the Technical University of Wroclaw, Poland, where she started her professional career as a tenured faculty member. She has worked with Bell Northern Research and MCNC and was a tenured professor with the Electrical Engineering Department, University of North Carolina at Charlotte. She was named one of the 10 most influential people in the printed circuit board (PCB) industry by PC FAB magazine and ATOMIC29 (2001-2002), and is an IEEE fellow. Turlik is a member of the NEMI board of directors and serves on the advisory boards of several colleges and universities.
The first roadmap, published in December 1994, was spearheaded by Walker and Lance Glasser, then director of the Electronics Technology Office at the Defense Advanced Research Projects Agency (DARPA). These two individuals helped organize the National Electronics Manufacturing Framework Committee to study the challenges facing the nation in electronics manufacturing and to develop technology roadmaps and policy options with which to address these challenges. The resulting roadmap was published by the American Electronics Association (now AeA) and the Electronic Industries Association (EIA, now the Electronic Industries Alliance). NEMI was incorporated the following year (1995), and the consortium has published a roadmap every other year since 1994.
The tenth anniversary banquet begins with a reception at 5:30 p.m. followed by dinner at 6:30. The roadmap workshop, which will review year-to-date progress on the 2004 NEMI Roadmap and solicit feedback and input from workshop participants, is scheduled for Wednesday, June 23.
For more information, visit: http://www.nemi.org/roadmapping/june_TWG.html.
Copyright 2004, UP Media Group. All rights reserved.
Electronics manufacturing professionals convened at the 14th annual NEPCON Shanghai/EMT China electronics manufacturing exhibition and conference in Shanghai from April 26-29. According to the joint organizers Reed Exhibitions and the CCPIT - Electronics Sub-Council, the show attracted 13,528 industry professionals, an increase of 10% from last year show.
In an exhibiting area of 32,000 sq. meters, 650 companies exhibited their latest electronics production technologies. The show attracted surface-mount technology equipment and materials, test and measurement, electronics components and other sub assembly suppliers. Industry groups from 21 countries and regions participated, including China, Japan, Germany, Singapore, Taiwan, the UK and U.S.
According to organizers, 80% of the industry suppliers were represented at the show, including Agilent Technologies, American Tec, Assembleon, DEK, Electronic Scientific Engineering, FlexLink, Fuji, Gelec, Kasion, Hitachi Hi-Tech, Leeport, Mydata, Nutek, Omron, Siemens Dematic, Sun East, Teradyne, Universal Instruments and Yamazen. Nearly 40% of exhibitors have rebooked their space for next year's show 2005.
George Yang, China Marketing Manager of Siemens Dematic China Ltd said, "China is playing an important part of Siemens' global growth. We see Shanghai as a fast-developing business hub. The fair was excellent for us, both the number and the quality of the visitors. It was better than last year and definitely exceeded our expectations."
"Compared to last year, this show was bigger and there were a higher number of visitors, said Nithia Devan, Marketing Communications Manager of Assembleon, Asia Pacific. "We had several qualified visitors plus important customers asking questions and attending demos on our machines...[W]e feel that by attending this show, we are letting the market know that we are here to offer solutions."
Copyright 2004, UP Media Group. All rights reserved.
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