News
The 90-day average of worldwide bookings was $1.61 billion, up 3% from the revised May numbers and 123% year-on-year.
The 90-day average of worldwide billings was $1.48 billion, up 5% from May and 91% ahead of last year.
"Despite the premature negative commentary by some Wall Street analysts, the semiconductor equipment industry continues to maintain growth at high levels," said Stanley Myers, president and CEO of SEMI. "Total bookings remained strong throughout the second quarter and are at levels more than double that of one year ago."
A book-to-bill of 1.08 means that $108 worth of orders were received for every $100 of product billed for the month.
Carlsbad, CA -- Asymtek (www.asymtek.com) has developed a method for applying solder ball reinforcement material to semiconductor packages that can eliminate the need for dispensing secondary underfill in PCB assembly.
The company's DispenseJet DJ-9000 shoots a fluid stream of underfill adhesive as small as 100 micrometers wide between balls on CSPs and other BGA packages during the semiconductor packaging process. Other methods of pre-applied underfill have resulted in contaminating the solder balls or have been too costly to ramp into production.
Jetting the underfill prior to board assembly without contaminating the solder balls allows semiconductor packaging companies to offer packages with improved reliability without the cost of traditional underfilling.
Typically, CSPs or other BGA packages require adhesive underfill to glue the component rigidly to the PCBA to prevent failures due to shock. If the primary failure of a non-underfilled CSP or other BGA package occurs at the ball-package interface, the pre-applied solder ball reinforcement reduces the probability of joint failure at that interface.
The cured reinforcement material relieves the stress at the ball-substrate interface by reducing the geometric stress concentration factor at that point. Therefore, the solder joint withstands more load during shock-loading or thermal cycling.
Copyright 2004, UP Media Group. All rights reserved.
MfgQuote (www.mfgquote.com) is an online sourcing solution for custom manufactured parts and engineered components. Buyers, engineers and purchasing professionals submit and distribute request for quotes (RFQs) through the secure online system.
Suppliers have the opportunity to match their expertise, equipment and capacity to the buyers who need their services. The site gives them the tools to identify and build relationships with the right customers for their business with complete confidentiality.
The service is free to buyers (engineers, inventors and students), with suppliers and original equipment manufacturers (OEMs) paying a subscription fee for the opportunity to sell to the buyers.
Copyright 2004, UP Media Group. All rights reserved.
Press Releases
- Kitov AI Inc., FANUC America partner to advance AI-driven smart manufacturing solutions
- INSPECTIS AB ‘Makes it a Meal’ with Series U50s Advanced Kit
- Silicon Mountain Contract Services Enhances SMT Capabilities with New HELLER Reflow Oven
- Libra Industries Launches In-House High-Precision Underfill Capabilities