News
Sanmina-SCI Corp. (San Jose, CA), a global electronics manufacturing services (EMS) company, and Agilent Technologies Inc. (Palo Alto, CA), have announced a new technique for rapidly generating high-resolution, sub-surface 3-D scans of complex multilayer backplane and printed circuit board assemblies (PCBAs).
Using Agilent's 5DX Series 5000 automated x-ray system, the new method verifies how well press-fit connectors with compliant pins are positioned within plated-through-hole (PTH) conduits.
Featuring multilayer construction that can exceed 48 layers, Sanmina-SCI's backplanes deploy high-density, press-fit connectors into PTH conduits with diameters that often measure 0.022 in. and smaller.
Kent Dinkel, Agilent's Imaging marketing manager, Automated Test Group, said, "Our 5DX system was designed to be a powerful x-ray tester always looking for new problems to solve. We salute Sanmina-SCI for galvanizing an application that has enabled the industry's first sub-surface 3-D scans of complex backplanes in production environments."
Dinkel also noted that press-fit connectors having compliant pins are becoming more widely used in a number of PCBA markets.
Sanmina-SCI noted that when multiple component types, including surface-mount devices, populate a backplane or PCBA, the new inspection method can scan the entire backplane—both surface and sub-surface simultaneously—to check solder contacts of components as well as press-fit connector contact integrity.
Copyright 2004, UP Media Group. All rights reserved
GE Commercial Finance, Global Electronic Solutions (GES, San Diego, CA), an equipment lifecycle management supplier, has appointed Roger Innes as president and CEO. In this position, Innes will be responsible for overseeing and directing all of GES on a global basis and ensuring continued GES growth. Under his leadership, GES will continue to add staff worldwide and develop new products and services.
Previously, Innes was managing director of capital markets and business expansion for GES. Building upon his experience in the technology equipment leasing and finance industries, Innes will continue to promote GES' platform—equipment acquisition, optimization and disposition—to customers worldwide.
"Roger's 20+ years of technological experience in the equipment leasing and finance industries, coupled with being one of the founders of creating the platform for managing the lifecycle of semiconductor equipment, truly makes him the most appropriate person to continue growing GES on a global scale," said Paul Bossidy, CEO of GE Commercial Finance, Commercial Equipment Financing.
Innes was cofounder and president of Comdisco Electronics, whose portfolio was acquired by GE in April 2002. Prior to joining GES, Innes served in various leadership positions in both sales and general management with Comdisco, GE Capital and Equitable Life Leasing companies.
Recognizing the challenges facing electronics assemblers as they convert to lead-free processes, Cookson Electronics Assembly Materials (Jersey City, NJ) is launching the CE Analytics Lead-Free Process Capability Validation Program.
The program consists of two elements: a test kit containing Cookson's laminates, pad finishes, stencils, lead-free solder paste and cored wire combined with boards, lead-free components and set up software from Practical Components. The second element is a lead-free process capability report based on CE Analytics' analytical evaluation and process capability validation services conducted on finished assemblies tested to IPC and J-STD requirements.
"We spoke with customers who were concerned about the time and cost associated with successfully transitioning to lead-free," said Tom Hunsinger, Cookson Electronics' product manager. "Their main concerns were reliably validating their lead-free process, and having a single source that offered all of the required materials and analytical services. They wanted to make one call to get the complete package."
The kit contains the consumable materials needed to set up and run a lead-free surface-mount process. The test boards are then built and sent to CE Analytics where lead-free process capability assessment services are conducted. The output is a detailed laboratory analysis report with recommendations for process optimization.
Cookson Electronics Assembly Materials, a Cookson Electronics company, manufactures materials used in electronic assembly processes. CE Analytics is Cookson's resource for diagnostics solutions, analytical services and applications expertise.
www.cooksonelectronics.com/no-lead
Copyright 2004, UP Media Group. All rights reserved.
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