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The U.S. Department of Defense awarded the nonprofit research group a research contract for the Vertically Interconnected Sensor Arrays (VISA) program. This contract is a collaborative effort between MCNC-RDI and DRS Infrared Technologies.
The program objective is to develop 3-D architectures and circuits that enable massively parallel signal processing for high-resolution IR focal plane arrays for strategic and tactical systems. The 3-D interconnect permits integration of detector arrays with multiple layers of ICs by means of insulated and metallized vias (vertical holes) etched through the body of the IC chips. The resulting multilayer structure offers optimal short interconnect paths and enables significantly higher interlayer bandwidths for more demanding signal processing requirements.
The weeklong Chinese Autumn holiday that ended this week has had a big impact on air freight conditions, says Trans Global Logistics. "Local factories pumped out high volumes of goods before the break and many factories continued to churn out goods during the week, adding to the backlog of cargo at regional transit hubs," the company said in a customer briefing. Transit times will likely grow, Trans Global says, as the cargo buildup is worked ouut.
Regional notes:
- Shanghai carriers have announced a rate increase of 9%, while transit times for deferred service have suffered because of the freight buildup. Export volume is projected to be strong through October.
- Big-project shipping will keep air cargo strong in Hong Kong through November.
- In Taiwan, carriers have announced a third round of peak season increases (10 to 15%), but those levels may not stick because the market is not as strong as expected. Anticipate longer transit times and higher costs for space and fuel, and book large-sized or "hot" shipments as early as possible.
The show will be held Oct. 12-14, in Amsterdam.
Elcoteq's model -- called Virtual Cluster -- is based on a partnership where the OEM focuses design and technology, and Elcoteq handles issues of manufacturability, the manufacturing equipment budget, production capacity, bill of materials, supply chain, and creating and maintaining a time-line and focus for production and delivery to the OEM's customer.
By jointly setting up a process of defined milestones to discuss upcoming products and manufacturing challenges, both companies are prepared for time and manufacturing adjustments, and the engineering department can focus on design instead of logistics, reducing time-to-market, Elcoteq says.
For more on the Virtual Cluster model, see next month's Circuits Assembly.
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