News
The electronics company has chosen a SnAgCuIn alloy for its high-reliability communications and medical gear and larger PCBs, according to Nikkei Shinbum News.
The company chose the solder for its melting temperature, tensile strength, thermal cycling and aging characteristics, the report said. SnAgCuIn melts at 204C, well below the point of other lead-free alloys. The alloy is supplied by Singapore Asahi Chemical and Solder Industries Ltd.
According to the report, another lead-free alloy -- this one SnZn -- failed to pass Hitachi's tests.
Hitachi said that while indium costs more than other metals, the price point is "only 20 to 30%" higher and that all lead-free alloys cost more than SnPb solder.
Japanese OEMs have been early adopters of lead-free alloys. According to the report, NEC, Sharp and Fujitsu use SnZn, while Panasonic uses SnAgBiIn.
The award honors SMTA members who stand out as leaders within the association.
In a press release, SMTA said Tsoi's devoted hours of time, personal financial support and leadership so that colleagues could benefit from SMTA membership via a local chapter. He was the first student from China to earn SMTA Certification and joined other chapter officers in Minneapolis for a Leadership Forum last March.
Frank, of FeinFocus GmbH, received the award for his paper "Detecting and Analyzing Wafer Bump Voids with X-ray Inspection," in which he disclosed an x-ray imaging technology said to detect and measure voids within solder bumps on chips. The paper also revealed software that determines component viability based on preset threshold values.
The event was sponsored by SMTA. Papers detailed leading-edge IC packaging and test technologies with special emphasis on 3D stacked packaging.
The x-ray inspection system detailed in Frank's paper converts 3D voids to measurable 2D images, enabling the system to calculate the ratio of the size of the void within a solder bump to the total mass of the ball. The system can also determine the largest linear distance between two points in the void and compare the result with the diameter of the ball.
The paper will soon be online in at smta.org.
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