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FRANKLIN, MA, Dec. 21 - Leading experts will explore SMT process challenges in a new series of free technical webcasts kicking off in January.

The events are sponsored by Speedline Technologies and are open to qualified individuals who register through the company's Web site.

"Speedline has designed these seminars to explore and deliver the in-depth information and how-to insight to help process engineers manage and control the major issues and challenges they will face daily throughout 2005," said Pierre de Villemejane, Speedline's president.

Each of the one-hour seminars will explore one of these challenges in a major manufacturing process - including lead-free wave and reflow, fine-pitch printing and underfill dispensing.

Hosted by experts who have been developing and implementing manufacturing techniques for more than 20 years, the sessions will include discussions of manufacturing floor challenges, new technologies, how-to implementation information and question-and-answer periods. Seminars begin at 11 a.m. Eastern.

  • Jan. 19: Statistical Process Control & Design of Experiments
  • Feb. 17: Lead-Free Overview
  • Mar. 17: Lead-Free Wave Soldering
  • Apr. 14: Lead-Free Reflow Soldering
  • May 17: Lead-Free Reflow Soldering Power and Nitrogen Consumption
  • Jun. 16: Underfill Dispensing
  • July 21: Fine Pitch Printing
  • Aug. 18: Lead-Free Overview
  • Sept. 15: Lead-Free Wave Soldering
  • Oct. 20: Lead-Free Reflow Soldering
  • Nov. 17: Tin Whiskers
  • Dec. 15: Fine Pitch Printing.

To register visit www.speedlinetech.com/seminars or call 508-541-4749.

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MINNEAPOLIS, Dec. 21 -- The second International Wafer-Level Packaging Congress will take place Nov. 3-4, in San Jose, conference organizers announced today. The event will explore cutting-edge semiconductor packaging, including chip scale, 3D, system-in-package, system-on-chip, system-on-package and wafer level.

Co-chair Dr. Ken Gilleo of ET-Trends LLC said in a press release that feedback from attendees "will allow us to expand on topics that are the most important and useful to attendees. The goal is to enable attendees to gain a great deal of practical information about wafer-level packaging that they can immediately apply to their work."

Exhibit space will be available, said conference sponsor SMTA, adding that IWLPC 2004 sold out.

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JUAREX, Mexico, Dec. 20 -- Electronics manufacturing services firm Elcoteq Network Corp. will buy consumer electronics giant Thomson's Juarez operations and take over its manufacturing in a deal worth over $1 billion.

Under the deal, expected to close Dec. 31, Elcoteq will acquire Thomson's manufacturing operation here, the companies annnounced today. Elcoteq is paying $33 million for the plant, which makes set-top boxes.

Elcoteq also signed a deal to build set-top box products for Thomson in Juarez. Thomson reportedly owns a 30% share of the global set-top box market.

Elcoteq expects the deal to boost the company's sales by approximately $300 million during 2005 and by $800 million to $1 billion during 2005 to 2007.

The acquisition of the Juarez plant will double Elcoteq's manufacturing capacity in Mexico. The Juarez personnel will be retained. Currently, the plant employs 2,000 workers.

In a statement Finland-based Elcoteq said the acquisition is part of a larger plan to balance its global footprint. The company earlier announced announced an expansion into Brazil.

"The Americas is the fastest growing geographical region within Elcoteq, and the addition of Thomson as a significant new customer both accelerates this growth and diversifies and expands the product and service portfolio within Elcoteq Americas," said Doug Brenner, president of Elcoteq's U.S. subsidiary.

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