News
Rae's paper, "Nanotechnology and Low Temperature Electronics Assembly," discussed concerns among board assemblers that some components are not - and will not - be ready for lead-free assembly.
He also revealed that assemblers of "exempt" boards -- military, aerospace, and automotive -- are finding that lead-containing components may no longer be available, which will force conversion of these complex boards.
Nanotechnology, Rae says, enables a number of tools which permit lower temperature assembly through enhanced solders, adhesives and novel attachment methods.
The award was selected by attendees of the Pan Pacific Symposium, which is sponsored by the SMTA.
UTICA, NY -- Dr. Ron Lasky, an expert on soldering, has launched a web log on electronics assembly.
The blog, sponsored by Indium Corp., is at indium.com/drlasky.
The blog offers comments on current events and ideas for process improvements. Readers can view the blog, follow links, and offer comments.
In a statement, Dr. Lasky said, "Blogging is a great method of staying in touch with our customers. It offers a quick way to share and record observations and ideas, and to solicit feedback. It lets our customers learn of, and weigh in on, important issues."
ALAMEDA, CA - Technology Forecasters' June conference on the EMS supply chian will be hosted by Microsoft at the software giant's main campus in Seattle.
The conference, known as Quarterly Forum, takes place June 9-10.
Microsoft recently joined the Quarterly Forum for Electronics Manufacturing Outsourcing and Supply Chain to strengthen relationships with outsourcing and supply chain partners in the electronics industry.
In a statement, a company spokesman said Microsoft is hosting the event "to help our suppliers and supply chain partners learn about and put in practice new business efficiencies to our mutual benefit."
TFI will release its annual benchmarking study on the EMS industry in June.
Press Releases
- Federal Electronics Adds AS9100 Certification to Hermosillo, Mexico Facility, Expanding Aerospace & Defense Capabilities
- SMTC Strengthens Leadership for Future Growth: Ed Smith Promoted to Executive Chairman; Mike Buseman Joins as CEO
- TTCI Expands Southeastern U.S. Presence Through Partnership with Microwave Component Sources; Bert Horner and Ryan Peavey Comment
- Essemtec Expands US Presence with New, Larger Demo Lab in Burlington, MA; Don Jeka Comments
POPULAR
- Editorial Contributions
- How Squeegee Blade Profile Helps Improve the Screen-Printing Process
- Verifying PCBA Cleanliness with Ion Chromatography
- Comparison of Aperture Designs, Solder Pastes, Nanocoatings and Print/Inspection Systems
- Systematic Troubleshooting in Electronics Assembly: A Case Study in Solder Balling and Process Optimization