News
Bannockburn, IL - As the electronics industry races to meet the EU's RoHS Directive, IPC and Soldertec Global --a division of Tin Technology-- are sponsoring the third International Conference on Lead-Free Electronics on June 7-10 in Barcelona.
Critical lead-free issues include new alloys and materials evaluations, inspection changes, tin whiskers, lead-free on advanced packages like chip scale and flip chip, and reliability. Assembly operations will face increased assembly costs (perhaps 15% higher) and will impact areas beyond manufacturing such as field support, sales, marketing and training.Conference topics and educational courses will cover:
Policy development: European/Asian/other legislation or voluntary activity on hazardous materials and recycling; Legislative compliance and policy enforcement methods;
Supply chain issues: Standards for marking and test; Materials declarations, part number, obsolescence, etc.;
Production issues: Design for lead free production; Component solder, board development, availability and lead-free compatibility; Examples of implementation; Reflow, wave, hand soldering, inspection, repair, rework and test;Cost issues: Tin whiskers; Reliability test data and method developments; High reliability product sectors (automotive, aerospace, etc.)
Environmental considerations: Toxicity and risk; Recycling; Substitutes for other hazardous substances.
HERNDON, VA -- A new standard for simplifying materials declaration being jointly developed by several leading trade groups will be circulated for industry review in June.
In a joint statement, IPC, iNEMI and RosettaNet said the draft of IPC-1752 will be released for a 60-day industry review on June 1.
The standard will integrate existing efforts, including recommendations from a pair of iNEMI projects plus RosettaNet's e-business process standards for material composition.
Alcatel-Shanghai Bell will implement eM-Execution to provide full component, product and process traceability to comply with both customer and regulatory requirements. Alcatel-Shanghai Bell is also the launch customer for the new eM-Execution Lead Free solution as it prepares to meet the July 1, 2006 RoHS regulations.
"As the telecom solutions provider, we will continue to improve our product and process traceability to ensure quick response to market demands. We rely on UGS to further improve our shop floor data collection, analysis and management to meet the new Lead Free regulations," said Martin Lehnich, executive vice president of Alcatel-Shanghai Bell.
Tecnomatix is the digital manufacturing brand of UGS, which acquired Tecnomatix Technologies Ltd. on April 1.
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- SMTC Strengthens Leadership for Future Growth: Ed Smith Promoted to Executive Chairman; Mike Buseman Joins as CEO