News
MINNEAPOLIS, MN—SMTA International, co-located with the Assembly Tech Expo (ATExpo) show at the Donald Stephens Convention Center in Rosemont, IL from Sept. 25-29, will feature many events concentrating on lead-free soldering technology and environmental compliance issues.
Courses will be held on the following lead-free topics:- Lead-free Manufacturing
- Lead-free Troubleshooting
- Lead-free Wave Soldering Process Troubleshooting
- Lead-free Inspection, Process Control and Defect Elimination
- Lead-free Rework
- Lead-free Reliability
- Lead-free Solder Joint Reliability
- Lead-free Surface Finishes and Compatibility with Lead-free Soldering
- Lead-free System Compatibility - Materials and Processes
- A - Z of Lead-free Soldering Master Class
- DFM: Surface Mount PCB Design Guidelines and Lead-free Assembly Process
Development
- Tin Whiskers: Historical Prospective, Test Method, Mechanisms, Reduction
and Elimination
- RoHS 101 and Lead-free Surface Mount Assembly
Almost 60 technical paper sessions will cover lead-free reflow and wave soldering, rework, key issues in lead-free/RoHS manufacturing, lead-free CSP reliability, HASL surface finishes, effects on PCBs, surface finishes, process control and RoHS test methods and compliance, customer and industry requirements, and due diligence approach to WEEE/RoHS compliance.
In addition, the Lead-free Soldering Symposium will consist of technical sessions organized by the Joint Council on Aging Aircraft / Joint Group on Pollution Prevention
(JCAA/JCPP) Lead-free Solder Consortia Project, as well as sessions on Process for Lead-free Implementation and Lead-free Reliability. It will provide the latest information on materials selections, lead-free processing techniques, and critical aspects of lead-free interconnection reliability, including backward/forward compatibility, moisture-level effects and failure analysis techniques.
Additional events include two lead-free panel discussions, a half-day workshop on Lead-free Reflow Soldering Using Convection Dominant Ovens, the opening ceremony on RoHS Compliance and Solder Trends and the SMTA Annual Meeting keynote on "The Impact of Temperature on Hybrid and Compliant Assemblies" by Dan Shea, CTO of Celestica.Many known Boundary Scan users, ATE vendors and chip manufacturers attended, including Siemens, Diehl Avionik, Phoenix Contact, National Semiconductor and Digitaltest. The companies discussed applications, test support and problem solving issues.
Previous Boundary Scan Days were held in Switzerland and Scandinavia, and they will also take place in Italy, the Benelux countries, France, Great Britain, the U.S. and Canada.
The first quarter loss from continuing operations rose to $1.5 million, from $1 million last year, as the company was hit with startup costs associated with new customers and new programs.
"As in most previous years, our first quarter sales declined from the
fourth quarter as our customer base typically has higher demands in the fourth
quarter," said Paul J. Plante, president and CEO in a statement.
Gross profit percentage was 11%, 110 basis points higher than last year
and 80 basis points higher sequentially.
Plante said the new programs will result in increased revenue and margin in the second quarter.
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