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SAN JOSE -- Venture Outsource Group has reported a sharp rise in the number of employment searches it is conducting for EMS, ODM and technology OEM client companies.

 

The firm helps companies find candidates to fill internal postings for a variety of managerial and executive-level positions across the globe. In 2005, the firm has helped client companies fill nine positions. The company is on track to engage in more than twice the number of client search assignments it executed in 2004.

This is not necessarily a sign that the electronics outsourcing industry is improving as a whole, but may instead reflect the increasing role VOG is playing with company hiring activities in industry.  

Aurora, COAdvanced Circuits, a quick-turn PCB manufacturer, has invested more than $1 million in new equipment to be installed between now and the end of the year. The investment will enable the company to keep its “On Time or It’s Free” guarantee.

New purchases include:

  • Automated strip-etch-strip (SES) line.

 

  • Debur equipment, offering cleaning for small holes.

 

  • Lead-free hot air solder level (HASL) unit. 

 

  • HASL pre- and post-clean lines.

 

  • Handling equipment for the HASL and SES lines.

 

Dan Chouinard, VP of plant operations, said “Investing in new equipment allows us to not only produce superior boards, but also consistently ship them ahead of schedule. An extra day or two means a lot to our customers who are responsible for meeting tight deadlines and juggling numerous projects.”

 

Ashburn, VA – Recent studies by Zestron have concluded that the emergence of lead-free products will significantly increase the need for cleaning in the electronics industry.

“The use of alternative solvents with higher boiling points, increased rosin contents as well as more aggressive activators will change the particular application needs in the context of cleaning,” said Umut Tosun, application technology manager.

The study, which involved the 40 latest lead-free solder paste formulations, revealed that the removal of flux residues from soldered assemblies provided very satisfactory cleaning results.  In addition to flux residues, the company was also able to fully remove uncured, lead-free pastes from stencils and misprinted assemblies. Solvent and MPC-based products were used to conduct all trials.

For more info, visit: Lead-Free Cleaning: Moving from Eutectic to Lead-Free.

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