News
Washington, DC – Plans are underway for the IMAPS International Conference and Exhibition on Device Packaging, March 20 – 23, 2006, in Scottsdale, AZ.
The conference is dedicated to the challenges and technologies for packaging and devices of all types. Dr. Andrew Strandjord, IMAPS VP of technology and Device Packaging ’06 general chair, said in a statement, “This Conference will feature a new format – six workshops concentrating on 3-D Packaging; Copper/Low-K; Flip-Chip Technologies; High Frequency/Microwave; MEMS; and Optoelectronics.”
It will also feature an exhibition and technology showcase.
For more info., visit imaps.org/devicepackaging.
The conference is dedicated to the challenges and technologies for packaging and devices of all types. Dr. Andrew Strandjord, IMAPS VP of technology and Device Packaging ’06 general chair, said in a statement, “This Conference will feature a new format – six workshops concentrating on 3-D Packaging; Copper/Low-K; Flip-Chip Technologies; High Frequency/Microwave; MEMS; and Optoelectronics.”
It will also feature an exhibition and technology showcase.
For more info., visit imaps.org/devicepackaging.
MINNEAPOLIS -- The annual Pan Pacific Microelectronics Symposium
& Exhibit will focus on lead-free PWB finishes, 3-D integration,
lead-free package finishes and advanced flip chips.
The dual keynotes are, Prospects and Challenges of Nano-Packaging for Electronic and Bioelectronic Systems, will be given by Rao Tummala, Ph.D., of the Georgia Institute of Technology, and Summary of New England Lead-free Consortium Implementation Plan of High Volume Assembly of Printed Wiring Boards, by Sammy Shina, Ph.D., of the University of Massachusetts Lowell.
The event takes place Jan. 17-19, in Hawaii and is sponsored by the SMTA.
Other sessions will cover thermo-mechanical reliability, materials deposition, MEMS and sensor networks, and embedded and SiP packaging, materials and process management and reliability testing and failure analysis.
Sponsors include 3M Co., Asymtek, Dow Corning, Indium, Libra Industries and Sonoscan.
For details visit smta.org/pan_pac.
The dual keynotes are, Prospects and Challenges of Nano-Packaging for Electronic and Bioelectronic Systems, will be given by Rao Tummala, Ph.D., of the Georgia Institute of Technology, and Summary of New England Lead-free Consortium Implementation Plan of High Volume Assembly of Printed Wiring Boards, by Sammy Shina, Ph.D., of the University of Massachusetts Lowell.
The event takes place Jan. 17-19, in Hawaii and is sponsored by the SMTA.
Other sessions will cover thermo-mechanical reliability, materials deposition, MEMS and sensor networks, and embedded and SiP packaging, materials and process management and reliability testing and failure analysis.
Sponsors include 3M Co., Asymtek, Dow Corning, Indium, Libra Industries and Sonoscan.
For details visit smta.org/pan_pac.
SAN JOSE -- Tessera
Technologies, a fabless chip packaging company, has entered into a definitive agreement to purchase
certain assets of Shellcase Ltd., for
$33 million in cash. The deal is pending standard closing conditions
and regulatory approvals and is expected to close in the December
quarter.
Shellcase is a provider of commercial wafer-level image sensor packaging. Its technology portfolio includes wafer-level packaging for image sensors and other devices used in cellphones that integrate digital cameras.
"Tessera is one of the world's leading technology development and licensing companies. This, in combination with the Shellcase technology and team, will enable us to grow the new business substantially," said Bruce McWilliams, Tessera's chairman and chief executive officer. "Furthermore, it solidifies our position in the wafer-level packaging market for image sensors and MEMS devices, which we believe to be among the semiconductor industry's fastest growing market segments."
According to Prismark Partners, a research firm, the image sensor market is expected to grow from approximately 520 million units in 2004 to approximately 1.3 billion units by 2009. And In-Stat forecasts the MEMS market to grow from 2.4 billion units in 2004 to nearly 6 billion units by 2009.
Shellcase is a provider of commercial wafer-level image sensor packaging. Its technology portfolio includes wafer-level packaging for image sensors and other devices used in cellphones that integrate digital cameras.
"Tessera is one of the world's leading technology development and licensing companies. This, in combination with the Shellcase technology and team, will enable us to grow the new business substantially," said Bruce McWilliams, Tessera's chairman and chief executive officer. "Furthermore, it solidifies our position in the wafer-level packaging market for image sensors and MEMS devices, which we believe to be among the semiconductor industry's fastest growing market segments."
According to Prismark Partners, a research firm, the image sensor market is expected to grow from approximately 520 million units in 2004 to approximately 1.3 billion units by 2009. And In-Stat forecasts the MEMS market to grow from 2.4 billion units in 2004 to nearly 6 billion units by 2009.
