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FRANKLIN, MA – As SMT manufacturing continues to move towards smaller components, it becomes increasingly important to meet fine pitch requirements. With 0201 chips, chip scale packages and microBGAs becoming more prevalent, process engineers must understand every aspect of the fine printing process.
 
Speedline Technologies will address fine pitch printing in a free, live, Web seminar on Thursday,
Dec. 15, from 11 a.m. to 12 Noon, EST. 
 
Topics will include:
* Squeegee selection
* Solder paste evaluation
* Lead free solder paste printing
* Stencil design, including pin-in-paste
* Aperture design
* 45 degree printing
* Board support
* Fast cycle time printing
* Post-print inspection (2D and 3D)
 
For more info and to register visit: speedlinetech.com/seminars or call 1-508-541-4749.

ALAMEDA, CA – Chinese companies are moving up the value chain in product design, and their engineering teams offer customers an increasing array of technical options and product features. That’s according to a new report by Technology Forecasters Inc. (techforecasters.com).

Chinese electronics manufacturing and design (EMD) services are forecast to grow 95% from an estimated $38.3 billion in 2005 to $74.7 billion in 2010, TFI found.


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SAN FRANCISCO -- The nation's CIOs project IT spending to increase to 6% over the next year, according to a poll taken in November, up one point from October.

Spending projections were up or flat in most categories month over month, said Deustche Bank and CIO magazine, who administer the poll.
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