caLogo

News

SHANGHAI – Nepcon China, Shanghai’s largest electronics manufacturing trade show, offered some changes over 2006, but mostly more of the same.

On the plus side, attendance has been strong and steady. And next year’s show is reportedly already sold out. The downside is that there simply isn’t much in the way of new equipment or materials.

Attendance slowed Wednesday, the second day of the show, despite a noticeable uptick in the number of Westerners, observed CIRCUITS ASSEMBLY, the only U.S.-based publication here at the show this week.
Read more ...
ROME, NY – The Electrostatic Discharge Association has announced its annual $10,000 university research grant. Applicants may include any academic professor or researcher who wishes to conduct exploratory work in the field of ESD, including device/design, materials, test methods, or factory control methods. The grant is a one-year subsidy and will be announced in September.
 
The outcome of the research should advance the fundamental understanding of ESD knowledge. Researchers are required to first publish the outcome of the work at the ESD Symposium before submitting to any professional journal.
 
To apply, send an email to info@esda.org indicating you are applying for the research grant. A clear outline of the title, purpose, approach, and expected outcome of the work must be included. Applicants should include a 500-word summary on how the proposed work would advance the understanding of ESD. The summary should indicate how the research relates to the ESD Technology Roadmap (available at www.esda.org).
 
All applications must be received by June 30 to be considered. 

CARLSBAD, CAAsymtek is offering a conformal coating and jet-dispensing workshop on May 3 at the Doubletree Hotel in Orlando, FL. The workshop will focus on electronics assembly for military and industrial applications and will feature speakers from Dymax, Henkel, Humiseal, Lockheed Martin and Asymtek. Sessions will contain information on adhering to military specifications; applying conformal coating materials and chemistries; tin whiskers and how to avoid reliability risks, and non-contact fluid jetting technology for flip-chip and chip-scale package underfill. The free, all-day workshop will feature live video demonstrations.
 
For more information and to register, please visit: http://www.asymtek.com/news/seminars/orlando2007/.
 

Page 4149 of 5003

Don't have an account yet? Register Now!

Sign in to your account