SAN JOSE, CA – Jan Vardaman, president of TechSearch International Inc., will keynote the annual MicroElectronics Packaging and Test Engineering Council technical symposium in San Jose on Nov. 8.
In her keynote presentation, Markets and Trends in Laminate Substrates, Vardaman will present findings of the SEMI/TechSearch International Global Semiconductor Packaging Materials Outlook and provide insight into trends driving substrate developments, trends in feature size, and materials, including production capacity considerations and pricing trends.
Vardaman is the founder of TechSearch International, and the coauthor of How to Make IC Packages (published in Japanese), a columnist with Circuits Assembly, and author of numerous publications on emerging trends in semiconductor packaging and assembly. 
In addition to the keynote presentation, the program has been segmented into the following focus sessions: Substrate Manufacturing and 1st Level Interconnect Technology; Design and Simulation: Silicon, Substrate, System; 2nd Level Interconnect and Reliability, and Emerging Substrate Technologies.
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