HERNDON, VA—The International Electronics Manufacturing Initiative (iNEMI) has released two documents to help manufacturers reduce the risk of tin whiskers in lead-free products.

The first is JEDEC standard JESD22A121, "Test Method for Measuring Whisker Growth on Tin and Tin Alloy Surface Finishes," and the second is the updated "Recommendations on Lead-Free Finishes for Components Used in High-Reliability Products," from the iNEMI Tin Whisker User Group. 

The JEDEC standard provides: an industry-standard method of measuring and comparing whisker propensity for different plating or finish chemistries and processes; a consistent inspection protocol for tin whisker examination; and a standard reporting format.

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IRVINE, CA -- Following the opening of its Research and Applications Center in Irvine, CA, Henkel has completed its 900 sq. m. Hemel Hempstead facility expansion in the United UK.  
 
Long a center of R&D for the company's line of solder products, the facility is now also home to several other complementary Henkel businesses, including automotive electronics, industrial and automotive adhesives and sealants. 
 
The addition includes several new laboratories: an applications lab for adhesives and sealants, a metal pre-treatment and coatings lab, analytical laboratories, an equipment assembly area long enough for a complete automotive vehicle and a long-term corrosion testing area. 
 

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Jersey City, NJ -- Cookson Electronics has opened its advanced Technical Service Center and warehouse facility in the Zhong Dian Lu Ke Industrial Park in Shanghai. The $3 million facility will house more than 60 employees.
 
The 1,500 sq. meter facility will be the company's base in China, providing local-language technical support from the Cookson's three electronics companies (the Assembly Materials Group, Enthone and Polyclad) to fabricators and assemblers of PCBs, and assemblers of semiconductor packaging. 
 

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