ARLINGTON, VA -- The Government Electronics and Information Technology Association is publishing three industry consensus documents to help aerospace, defense and other electronics segments comply with the EU RoHS and WEEE Directives.

Although aerospace and defense products are expected to be either out of scope or exempt from the directives, the aerospace and defense industries will be swept along as the larger global electronics industry transitions to lead-free products, according to GEIA.

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SAN JOSE – Flextronics will license Tessera's wafer-level assembly technology under a just-signed deal, the companies said yesterday. No financial terms were announced.

Under the terms of the agreement, Flextronics will use Tessera’s Shellcase CF technology in its entire camera module line.

Shellcase CF is a wafer-level technology that uses the manufacturing infrastructure of conventional chip-on-board assembly processes, while resolving the challenges associated with increasing resolution and decreasing pixel size in image sensors. The technology is used to assemble optical components integrated into electronics products such as miniaturized cameras in camera phones, digital still cameras and video camcorders.  

TEMPE, AZ — Economic activity in the manufacturing sector grew in August for the 39th consecutive month, while the overall economy grew for the 58th consecutive month, according to the latest survey of manufacturers by the Institute for Supply Management.

"Manufacturing growth continued at a very strong pace in August. Though the rate of growth was slightly under that of July, the sector continues to enjoy strength in new orders and production," said ISM spokesman Norbert J. Ore.

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