• Test and Inspection
    Evaluating ROI of AXI vs. AOI
    A model for calculating savings from reduced DPMO against equipment investment costs clearly demonstrates that the economic benefits of either technology depend upon the board complexity, throughput, labor costs, cost of field failures and returns, and equipment performance, as well as capital equipment, programming and operating costs.
    Keith Fairchild

  • Supplier Sourcing
    Prototype vs. Production Outsourcing
    When outsourcing PCBs, OEM procurement staff must fully understand the differences and nuances associated with prototype and production manufacturing, regardless of where those services are situated.
    Zulki Khan

  • Board Finishes
    Pb-Free Hot Air Leveled Solder Coatings
    A series of tests from wetting balance to copper dissolution show that the most popular Pb-free pastes work better with HAL versus other common finishes.
    Howard Stevens and Nimal Liyanage, Ph.D.

  • Cover Story
    Simulating Pb-Free Reflow
    Computational fluid dynamics simulation of the reflow oven makes it possible to design PCBs for Pb-free manufacturing by predicting thermal gradients during solder reflow processing.
    Sherman Ikemoto and Robin Bornoff

  • The Dover Deals
    'Confusion and Clarity'
    As a new owner – Francisco Partners – enters the scene, what's in store for Universal, Vitronics and Unovis?
    Mike Buetow


  • Caveat Lector
    The downside of higher stocks.
    Mike Buetow

  • Talking Heads
    TXP's Eric Miscoll.
    Mike Buetow


  • Focus on Business
    Preventative maintenance.
    Dr. Jonathan Linton


  • Screen Printing
    Printer customization considerations.
    Joe Belmonte

  • Better Manufacturing
    When Lean goes too far.
    Phil Zarrow

  • Soldering Tips
    To flip, or not to flip?
    American Competitiveness Institute

  • Wave Soldering
    Configurations for soldering conveyor angles.
    Gert Schouten

  • Equipment Advances
    Assembléon's "A" series of placement machines.

  • Technical Abstracts


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On the cover: Predicting thermal gradients during reflow. (Photo courtesy Flomerics)

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