Universal Instruments Corp. (UIC, Binghamton, NY) announced recently that it has established requisites for a long-term partnership with Shanghai, China-based DaimlerChryslerSIM Technology (DCSIM Tech.). DCSIM Tech. is a joint venture between DaimlerChrysler and Shanghai Institute of Microsystem and Information Technology.

According to UIC, the objective is to build local expertise in advanced electronics packaging. The two companies will invest in China's future in these technologies by training engineers, working with local suppliers, increasing local infrastructure and supporting local company projects for first- and second-level packaging.

"Our vision is to build an industry capable of servicing local Chinese component manufacturers and assemblers as well as export markets throughout Asia and worldwide," said Richard Boulanger of UIC's SMT Laboratory. "Both businesses will invest substantial resources to nurture local technical expertise and enhance the local infrastructure in Shanghai and Suzhou."

"Both companies are well positioned to develop China's high-tech electronics industry," stated Dr. Xiaoming Xie of DCSIM Tech. "As one of the major players on the local market for many years, I am pleased that this agreement has established long term objectives, as a high level of ongoing commitment is the only truly effective way to establish China as a global center of excellence."

Under the draft terms, UIC—with laboratories in Binghamton and Suzhou, China—will also help sponsor a student from DCSIM Tech. to join the electronics packaging program at Binghamton University. DCSIM Tech. will offer students and other resources such as failure analysis and reliability testing for specific Universal projects.

www.uic.com

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FocalSpot, Inc. (San Diego, CA), a provider of inspection and rework/repair solutions and services, recently announced that contract manufacturer Vanguard EMS (Portland, OR) has selected Den-on Instruments, RD-500 for advanced rework applications, including rework of lead-free assemblies.

Designed for both lead-free and standard solder, the system is a vision-based, semi-automated reflow, removal and placement rework station for printed circuit assemblies, surface-mount devices (SMDs) and connectors. The system combines high-powered top and bottom heater configuration with auto-profiling technology to efficiently heat and reflow rework applications—from small personal digital assistants (PDAs) and cell phones to personal computer (PC) motherboards and multi-layered avionics back planes.

Vanguard selected the system based on its efficient heating technology, ease-of-use and price performance. FocalSpot's product manager, Raymond LaFleur, was tasked during the evaluation to demonstrate the performance of the machine on several demanding applications, including lead-free rework.

http://www.vanguardems.com

http://www.FocalSpot.com

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UP Media Group Inc. (Atlanta, GA) has announced a call for abstracts for PCB Design Conference East 2004 (PCB East), which will be held Oct. 4-8, 2004, at the Holiday Inn in Manchester, NH. Sponsored by industry trade magazines Printed Circuit Design & Manufacture and Circuits Assembly, PCB East annually provides attendees and vendors with an East Coast conference and exhibition for engineering, design and manufacture professionals.

 The five-day conference is made up of a three-day Technical Conference that features short courses and papers, and two days of Professional Development one-day and two-day courses.

Papers and presentations are being sought for the Technical Conference, based on the following course durations: 30-minute paper sessions, one-hour lectures or panel sessions, two-hour workshops or panel sessions, and half-day (3.5 hour) seminars. Papers and presentations also are sought for a Professional Development Curriculum of one-day and two-day tutorials.  

Papers and presentations are sought for, but not limited to, the following topics:
- High speed, high frequency and signal integrity
- Impedance and crosstalk control
- EMI/EMC analysis
- Thermal analysis
- RF and microwave
- Packaging and components
- Area arrays
- FPGA design and implementation
- Embedded passives and active devices
- Flexible circuitry
- HDI design and technologies
- PCB design/layout techniques
- Component library creation and management
- Design for manufacture, test and assembly
- Design (including analog, digital and power supplies)
- PCB fabrication
- Soldering (especially lead-free and its impact on design)
- Surface finishes
- Industry forecasts
- Business and design/supply chain issues

To be considered as a speaker or presenter for PCB East, fill out the online submission form or send an email to Conference Chair Andy Shaughnessy, ashaughnessy@upmediagroup.com, by April 5, 2004. Your e-mail should include: a suggested course title, a suggested course length, a short description of your target audience, a 100- to 300-word abstract and a short speaker bio.

Each speaker/presenter will receive a copy of the Technical Conference Proceedings CD-ROM, a free pass for the three-day Technical Conference and free admission to the two-day exhibition, keynote address and other special events.

For more information or to submit a paper and/or presentation online, visit www.pcbeast.com.

UP Media Group (UPMG) specializes in magazine publishing and trade show and conference production. UPMG currently publishes Printed Circuit Design & Manufacture and Circuits Assembly. In addition, UPMG produces two annual conferences and trade shows for the design and manufacture industry—PCB Design Conference West in the San Jose, CA area, and PCB Design Conference East in the Boston area. UPMG also hosts the PCB Road Series of technical seminars in cities throughout the U.S.

Copyright 2004, UP Media Group. All rights reserved.

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