Minneapolis -- The Harsh Environment Electronics Workshop cosponsored by SMTA and Auburn University will be held June 28-29 in Indianapolis. The workshop will address concerns related to harsh environment electronics and challenges for auto electronics. It aims to combine the needs of end-users with the capabilities from  research and industry.
 
Will addresses the challenges of meeting expanding temperature ranges (-55°C to +150°/200°C) with increased vibration, higher packaging density and longer reliability. Next-generation requirements for automotive electronics are explored from the systems level and potential supply based solutions are presented.
 
Industrial needs for non-automotive vehicle requirements will be addressed, with session topics on:
- Thermal Interface Materials
- Component Reliability
- Module Overmolding
- Systems Design
- Lead-Free Soldering and Solder Alternatives
 
The workshop will also feature a panel discussion on lead-free for harsh applications.  
 

Bannockburn, IL - As the electronics industry races to meet the EU's RoHS Directive, IPC and Soldertec Global --a division of Tin Technology-- are sponsoring the third International Conference on Lead-Free Electronics on June 7-10 in Barcelona.                                                  

Critical lead-free issues include new alloys and materials evaluations, inspection changes, tin whiskers, lead-free on advanced packages like chip scale and flip chip, and reliability. Assembly operations will face increased assembly costs (perhaps 15% higher) and will impact areas beyond manufacturing such as field support, sales, marketing and training. 

Conference topics and educational courses will cover:

Policy development: European/Asian/other legislation or voluntary activity on hazardous materials and recycling; Legislative compliance and policy enforcement methods; 

Supply chain issues: Standards for marking and test; Materials declarations, part number, obsolescence, etc.;

Production issues: Design for lead free production; Component solder, board development, availability and lead-free compatibility; Examples of implementation; Reflow, wave, hand soldering, inspection, repair, rework and test; 

Cost issues: Tin whiskers; Reliability test data and method developments; High reliability product sectors (automotive, aerospace, etc.)

Environmental considerations: Toxicity and risk; Recycling; Substitutes for other hazardous substances.