Sentry SMT pick-and-place on-board vision system has two modules: SIM and EPV. SIM (strobed inspection module) AOI system ensures no misplaced boards will be sent to the oven. EPV module (embedded process verification) evaluates errors detected by the SIM module. Process is recorded photographically in real time. SIM system consists of several single modules within the line, including high-speed focus cameras with integrated stroboscopic illumination. A master template of the assembled board to be produced is stored by the software. Board is scanned after screen printing to obtain master image, including 2- or 3-D paste inspection. Subsequent scan occurs between chip and IC assembly, then image is laid over master template and compared. SIM checks exact position of components on solder paste; component presence, tombstones, polarity, and dropped components. Requires no programming. EPV can be used as a standalone module or with SIM.

Juki, www.jas-smt.com

CR4000C reflow soldering oven has an overall length of 79” (200cm), four upper and two lower independently controlled heating zones and a 16” (400mmm) pin conveyor over a 20” (500mm) wide mesh belt. CR5000F is 120” long (304cm), has independently controlled five upper and five lower heating zones and an 18” pin conveyor over a 22.5” (570mm) wide mesh belt. CR6000 has six upper and six lower independently controlled heating zones and an 18” (450mm) pin conveyor over a 22.5” (570mm) wide mesh belt. Overall length is 164” (415cm). Each oven includes forced hot air convection, onboard profiling and KIC “Auto Focus Power” process optimization software.

Manncorp, www.manncorp.com

Pine-Shower reportedly removes flux residues, grease and other soils, and leaves a non-oily finish. Is said to be safe on ESD mats, work benches and equipment surfaces. Free of ionics and silicones that can contaminate PCBs. Contains no butyl cellosolve, is zero VOC, and has a less than 3% VOC under EPA guidelines. Is ready-to-use, or can be diluted for light surface and equipment cleaning.

Techspray, www.techspray.com

ScanINSPECT BGA has an intuitive user interface integrated with a high-res, color, 2-D image processing unit. Permits 100% inspection of ball placement on BGAs, in or out of trays. Is a desktop offline system that can be used for pre- or post-reflow ball inspection. Provides for the following ball inspections: presence/absence; size; position; extra balls, and surface quality. Each device or tray is placed on the table, shuttled in, automatically aligned and inspected with a pass or fail result. For use before or after reflow.

ScanCAD International, www.scancad.com