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VW-9000 high-speed microscope incorporates a built-in light source, LED monitor, analysis software and PC components. Can be used for standard high-speed applications and as a digital microscope for inspection and development work. Has a redesigned CMOS sensor; is capable of recording high-speed processes at up to 230,000 frames per sec.; can capture video for up to 13 hrs. Controller supports color and monochrome cameras. High-speed recording is automatically played back in slow motion. Motion graph function graphically displays changes in a target’s movement. Recorded footage can be edited and analyzed directly on the controller. Automatically tracks moving objects in recorded footage to quantify speed, acceleration, distance, angle and other measurements. Error monitoring function automatically analyzes repetitive movements to determine when an abnormal event occurs.

Keyence, www.digitalmicroscope.com/PRVW9

Halogen-free NC-560-HF Pb-free, no-clean solder paste reportedly increases process yields with ENIG, OSP, HASL and immersion silver boards. Delivers lot-to-lot stencil printing consistency, along with good print performance characteristics, including full pad and component wetting and good surface tension, eliminating aperture clogging for up to 20 prints; minimal residue that is non-conductive and non-corrosive; thermal stability at temperatures up to 300°C; viscosity of 650-850 Kcps +10%; low beading and anti-tombstoning; wide process windows with long stencil life, and initial tack value of 33g force. Complies with RoHS; meets highest IPC-7095 voiding performance classification. Is compatible with ICT and AOI.

Amtech, www.amtechsolder.com

Single and double row solder cup spring pin header strips are for wire termination in test and field applications where stackup tolerances or blind-mating can be a challenge. Each spring pin provides 0.0275" of mid-stroke compression (0.055" max. compression) and is rated for one million cycles. Solder cup is sized to accommodate up to a 22 AWG wire; has gold-plated brass components and beryllium copper springs. 824 and 826 series headers feature spring-loaded pins rated at 3A max. (2A continuous use), high-temperature Nylon 46 insulators; come in 2-64 positions single row and 4-64 double row.

Mill-max, www.mill-max.com/PR618

Renew eco-stencil AQ batch stencil cleaner is designed for ultrasonic and spray-in-air systems. Removes all types of solder paste (e.g. water-based, RMA, no-clean, Pb-free) and uncured adhesives from stencils and misprinted boards. Is a drop-in replacement for semiaqueous and aqueous cleaners. Compatible with frame, screen, stencil and adhesives. Is compliant with CARB (California Air Resource Board), REACH and WEEE.

Techspray, www.techspray.com  

Stand-up tip caps seal syringe barrel tips during storage and shipment. Have large, flat bottom surfaces that enable syringe barrel to stand upright. Existing entrapped air migrates to piston, to ease removal. Are molded from polypropylene resin; compatible with a range of dispensing fluids. Feature large knurled gripping surfaces for simple installation and removal. Come in packs of 50 and bulk packages of 1000.

Techcon Systems, www.techconsystems.com

ME-555 underfill encapsulant was developed for semiconductor packaging and assembly. Is comparable with underfills such as Henkel 4256; offers excellent flow characteristics, thermal cycling reliability and low coefficient of thermal expansion. Is a high purity, semiconductor-grade epoxy underfill material for the encapsulation of flip chip devices. Reduces warpage; handles over-molding processes. Can be used under CSP/BGAs and small dies with standoff heights as small as 25µm. Provides good adhesion to laminate, ceramic, solder mask and metal surfaces, as well as high Tg and high fracture toughness.

Lord Corp., www.lord.com

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