Fanuc M-1ia is a lightweight, compact robot designed for small part handling, high-speed picking and assembly applications. Parallel-link structure reportedly provides higher speeds and accuracy compared to traditional assembly robots. Is available in two models (4- or 6-axis) for various applications and can be installed in multiple orientations. Is also available in three configurations, including robot-only (no stand), desktop mount with stand, and ceiling and angle mounting. Can be mounted to taping equipment. Enables part feeding from the sides of a work zone. Has R-30iA Mate rack-style controller.  Detachable color-graphic iPendant or monochrome pendant can be shared between multiple robots on the same assembly line.

Q Corp., www.qcorporation.com

3DIR metrology system includes confocal IR laser scanning microscopy for measuring post-bond parameters of 3-D stacked integrated circuits. Is a nondestructive, through-silicon metrology technique that monitors a variety of post-bond parameters, including overlay alignment accuracy, bonding interface thickness variations, and bonding interface quality including pre- and post-bond defect inspection and review. Measures alignment points at selected die of bonded wafers, stores images and data, and summarizes results. Correlation of overlay alignment offset data to electrical yield provide an early indication of bonded wafer yield. Software tools display data in the form of vector maps. Confocal capability permits thin optical sectioning in Z and construction of 3-D images of the bonded wafer interface and structures. 3-D reconstructions can be used to create sections in the XZ plane. Bonded wafers are automatically scanned at low magnification. Images are stitched together to form a single wafer image. When the overlay vector map is superimposed on the scanned wafer image, correlation of many of the failed overlay measurement points to bonded interface anomalies can be seen. Stitched image can be viewed and zoomed. Any site can be revisited and the image reviewed or rescanned and imaged using the IR microscope with objective magnifications up to 90x and 0.14µm pixel resolution.

Olympus Integrated Technologies, www.olympus-ita.com 

Gen6 C-SAM acoustic micro-imaging system retains virtual rescanning mode, digital image analysis, frequency domain Imaging and time domain imaging. Has inertially balanced linear motor scanner. Includes master control unit with a Windows 7-based computer with Intel QuadCore 64-bit processor. Operates Sonolytics software with PolyGate. Can select most useful resolution from under 1 mp to 268 mp. PolyGate permits automatic and simultaneous imaging of a sample at up to 200 different gates (horizontal “slices”). Useful searching for white bumps, die tilt, stacked die defects, etc. Has a 500MHz pulser with improved signal stability. Incorporates heated water to increase image quality by reducing signal and frequency losses in the coupling fluid.

Sonoscan, www.sonoscan.com

Series CLD standard electrically heated cabinet ovens are designed for use in Class 100 cleanroom. Are used for drying coatings onto printed circuit boards. One option has a max. operating temp. of 260°C and workspace dimensions of 36" x 36" x 39". Other capacities are available. A 20 KW total heat input is installed in Incoloy sheathed tubular heating elements. A 10000 CFM, 1-1/2 HP recirculating blower provides horizontal airflow across the workload, inside 4" insulated walls. Features Type 304, 2B finish stainless steel interior, with continuously welded seams, a #4 brushed finish stainless steel door cover and control panel face plate. Includes a 30" x 24" x 6" thick stainless steel high-temperature HEPA recirculating air filter.

The Grieve Corp., www.grievecorp.com