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A-Series Hybrid targets manufacturers in the semiconductor backend industry. Introduces parallel placement technology to applications like SiP, MCM manufacturing, and flip chip bonding. Includes programmable placement force control. Has fluxer dip station and high-accuracy cameras. Can bond flip chips at a repeatability of 10 µm, while placing at 2,500 components per hr. per single placement head. Die bonding speeds are 3,500 cph per head at 25 µm, while passives are placed at 8,000 cph at 40 µm. Can carry up to three specialized twin placement robots, holding two heads per robot, for a total flip chip bonding speed of 15,000 placements per hr. per machine. Can also carry conventional placement robots for chip shooting for passives as small as 01005.

Assembléon, www.assembleon.com

Screwdriver System is a series of high-precision electronic and mechanical torque control screwdrivers for electronics assembly applications. Uses scalable current reference to run entire torque range of the tool. Controllers feature digital and analog hardware for application flexibility. Small controller footprint; weighs less than 4 lb. Auto-sensing input voltage; quick-change connections. ESD-safe and clean room ready.

Weller, www.weller-tools.com

Vir-Stat air ionizers (VS-100) eliminate static charges in ESD-sensitive assembly areas. Are available in various configurations. Two bench-top units direct ionized air to the workspace directly in front of an assembler. One unit has an RS485 port for data collection; the other does not. Overhead ionizing units are available for controlling larger areas. Reduce "stiction" when handling extremely small insulative components.

Virtual Industries, www.virtual-ii.com

Positive Cavity Displacement ‘H’ Series high-resolution pumps are compatible with epoxies, thermal greases, underfills, oils, silicones and UV encapsulants. Are designed for GPD platforms and may be used with other robots or tabletop operations with a tabletop controller. Viscous fluids are delivered to the substrate via luer nozzles; performance excels when using ‘S’ Taper tips. Metering technique is not affected by variations in temperature or reservoir pressure. Luer dispense tips offer higher flow rates than standard luer nozzles with a lower pressure buildup.

GPD Global, www.gpd-global.com

CM-series ionic tester uses a solid gold test-cell, ballistic amplifiers, and high-volume pumping systems. Produces complete test solution change more than 6x per min. PC-based software is used to produce graphical test data, a pass/fail analysis, and automatic hard copy print-out using test methods according to MIL and DEF standards. Features include solid gold measuring cell and ballistic amplifier, providing a test accuracy of < 0.005mS/cm; curve-fitting analysis algorithm (merit of fit); complete testing within 3 min.; full regeneration in < 6 min.; accurate measurement, and automatic temperature compensation. Measures in accordance with all international and MIL specifications, and complies with J-STD 001, IPC-TM-650, and DEF Standard 00-100/3.

GEN3 Systems, www.gen3systems.com

FX SL inspection system reportedly offers accelerated throughput at more than twice the inspection speed of previous systems. For inspection of solder and lead defects, component presence and position, correct part, polarity and through-hole parts. Typically takes less than one hour to create a complete inspection program, including solder inspection. Inspects 01005 components. Uses a standard package library. Has Advanced Fusion Lighting and 5 MP image processing technology, including color inspection, normalized correlation and rule-based algorithms.

Nordson YESTech, www.nordsonyestech.com

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