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Fuji XP SMT nozzles come in standard and special nozzle designs for odd-form components, such as LEDs, switches and connectors. Are guaranteed to function properly with the following pick-and-place equipment: XP142, XP143 and XP242. Nozzles are also available for XP141 series machines and XP143 with automatic nozzle changer.

Count On Tools, www.cotinc.com

THERMLfilm HT is a high-temperature polyimide film able to withstand fluctuating temperatures, abrasion and chemicals. Is for high-density barcode and alphanumeric PCB labels. Topcoat provides a smooth printing surface. Is reportedly ideal for data matrix codes; provides consistent ANSI scannability. Static dissipating qualities of the topcoat minimize the risk of print voids. Heat resistance testing has revealed endurance at 500°F/260°C continuously for 5 min. and intermittently at up to 750°F/398°C.

FLEXcon, www.FLEXcon.com/HT

SN100C (551CT) is a Pb-free, fluxed-cored solder wire formulated for soldering tip temperatures up to 380°C with good tip separation for reduced icicles. Is said to deliver an Ag-free stable microstructure. Is designed for high-speed robotic soldering processes; excellent wetting and high spread factor offer increased soldering speeds with hand soldering. Said to provide fast wetting and increased spreadability over SAC 305.

Nihon Superior, www.nihonsuperior.co.jp

CI-1083-L and CI-1081-H conductive grid inks are for use in thin-film solar modules. Have been optimized for excellent conductivity and low contact resistance on transparent conductive oxides used in solar applications. CI-1083-series conductive grid inks have high solid contents and optimized rheologies to enable screen printing of high aspect ratio fine lines. Are low stress, low shrinkage thermosetting inks that reportedly offer excellent moisture resistance and low polymeric creep. Line resistivity is 8 mΩ/sq/mil (1 mil emulsion; 230 mesh).

Engineered Conductive Materials, www.conductives.com

VisionXC convection soldering system is tailored to market requirements such as those characterized by mobile device manufacturing. Has high throughput rates for high-volume production environments. Has optional dual-lane processing. Can be equipped with two conveyor lanes; can be operated asynchronously at different speeds. Can use the two lanes asymmetrically with different lane widths. Dual conveyors can be loaded with diverse PCBs printed with different solder pastes. Heating system permits selection of ideal reflow profiles for separate products.

Rehm Thermal Systems, www.rehm-group.com

MT9510 x16 16-site tri-temp pick-and-place handler is based on the technology of MT95XX. Ensures temperature performance from -55° to 175°C; features various options for advanced ESD protection. Can be kitted for a wide range of packages. Contact sites can be used in various combinations and offers an 8-site handling solution for large packages. All major features are identical to the MT9510 XP, including HMI, standard operation and maintenance, and a major portion of the spare parts and conversion kits.

Multitest, www.multitest.com/MT9510x16

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