2012 Issues

December 2012 cover

 

FEATURES

Reliability
Technical Diagnostics of Electronics Products: Application of Bayes Formula and Boltzmann-Arrhenius-Zhurkov
(BAZ) Model

For systems where failure-free operation is critical, technical diagnostics can recognize, in a continuous fashion and without dismantling, the ability to continue to function as expected over the long-term.
by Ephraim Suhir, Laurent Bechou and Alain Bensoussan

EMS Company of the Year of the Year
The Creation Resonation
Today's SMT operations rarely vary, which is why Creation Technologies is something of a
revelation in everything from its financial model to its factory layout.
by Mike Buetow

Supply Chain ControlSupply Chain Control
Using DNA to Ensure Component Authenticity
A new marking program for components provides users unalterable and traceable access to the part’s history and origin when marked and shipped by the original component manufacturer. In the case of open-market parts sourced by SMT, they will only be marked after they pass through its counterfeit mitigation and component quality inspection process. A look at how parts are "tagged" and traced.
by Tom Adams

Retrospective
Our dearly departed.
by Mike Buetow

 

FIRST PERSON

  • Caveat Lector
    'Cooking' up some changes.
    Mike Buetow

  • Talking Heads
    New SMTA president Bill Barthel.
    Jenny Popp

 

MONEY MATTERS

 

TECH TALK

  • Defects Database
    When rework causes rework.
    Dr. Chris Hunt

  • ESD Basics
    Principles for material selection and program decisions.
    The ESD Association

  • Screen Printing
    Height of our concerns.
    Clive Ashmore

  • Soldering
    Void reduction.
    Jochen Lipp

  • Tech Tips
    Hand soldering or selective?
    ACI Technologies

  • Test and Inspection
    The ICT investment.
    Jun Balangue

  • Solar Technologies
    Noncontact methods.
    Tom Falcon

  • Technical Abstracts
    In case you missed it.

 

November 2012 cover

 

FEATURES

Advanced Packages
Stepping Out With 0.4mm Pitch BGA/PoPs
OEMs are finding the move from 0.5mm pitch BGA PoP to the next generation, 0.4mm ultra-fine pitch BGA PoP tough, indeed. These rules-of-thumb will help make the jump.
by Syed W. Ali

Associations
The Mitchell Plan
IPC's new president is wasting no time remaking the trade group in his own (attentive) image.
by Mike Buetow

ESD Basics
You're Grounded!
Setting up an ESD workstation or area to reduce the risk of electrostatic discharge in the workplace.
by The ESD Association

Reliability
Electronics Failure Analysis for Pb- and Pb-Free Solder Joints
Why the Weibull distribution is probably the most important distribution for solder material failure analysis.
by Dr. Ron Lasky

Tech Tips
Manufacturing Cost Reduction through Automation
A step-by-step process to cut costs for a high-rel RF tuner.
by ACI Technologies

 

FIRST PERSON

  • Caveat Lector
    Brokering a new model.
    Mike Buetow

  • Talking Heads
    BBG's Greg Papandrew.
    Mike Buetow

 

MONEY MATTERS

    • ROI
      Restating value.
      Peter Bigelow

 

TECH TALK

  • Process Doctor
    Residues' slow burn.
    Michael McCutchen

  • Defects Database
    Skipping around.
    Dr. Chris Hunt

  • Getting Lean
    Continuous improvement plans.
    Carlos Rodriguez

  • Technical Abstracts
    In Case You Missed It.

September 2012 cover

 

FEATURES

BEST Site Visit
BEST: On the Go
From a motor home to a 25,000 sq. ft. factory outside Chicago, BEST not only offers a wide variety of rework/repair services, it is navigating a new path for the EMS of the future.
by Mike Buetow

Bare Die Coatings
Protecting COB Devices with Glob Top Encapsulants
Bare die and their connecting wires have no protective plastic package, and can easily become corroded by moisture or chemicals. Encapsulating the die and wires in a protective shell is critical to ensuring long-term assembly reliability.
by Venkat Nandivada

PCB Repair
Board Repair Made Easy
The small size and spaces make fixing a substrate or interposer a painstaking undertaking. A new novel board repair kit just might be the solution.
by Terence Q. Collier

Rework
Top 10 PCB Rework Mistakes
Why touch-up should be used sparingly, if at all, and other helpful hints.
by Bob Doetzer

 

FIRST PERSON

  • Caveat Lector
    Brokering a new model.
    Mike Buetow

  • Talking Heads
    Asteelflash's Gilles Benhamou.
    Mike Buetow

 

MONEY MATTERS

    • ROI
      The design-manufacturing gap.
      Peter Bigelow

    • Focus on Business
      Social media for the EMS.
      Susan Mucha

 

TECH TALK

  • On the Forefront
    Technology makeover?
    E. Jan Vardaman

  • Screen Printing
    Printing for power electronics.
    Clive Ashmore

  • Tech Tips
    TSOP bridging.
    Robert Dervaes

  • Soldering
    Vapor phase misconceptions.
    Jochen Lipp

  • Test and Inspection
    Functional turnkey.
    Adrian Ababa

  • Defects Database
    Packing MSDs.
    Dr. Chris Hunt

  • Materials World
    TMV PoP protection.
    Jie Bai

  • Technical Abstracts
    In Case You Missed It.

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