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Advanced Packages
Stepping Out With 0.4mm Pitch BGA/PoPs
OEMs are finding the move from 0.5mm pitch BGA PoP to the next generation, 0.4mm ultra-fine pitch BGA PoP tough, indeed. These rules-of-thumb will help make the jump.
by Syed W. Ali

Associations
The Mitchell Plan
IPC's new president is wasting no time remaking the trade group in his own (attentive) image.
by Mike Buetow

ESD Basics
You're Grounded!
Setting up an ESD workstation or area to reduce the risk of electrostatic discharge in the workplace.
by The ESD Association

Reliability
Electronics Failure Analysis for Pb- and Pb-Free Solder Joints
Why the Weibull distribution is probably the most important distribution for solder material failure analysis.
by Dr. Ron Lasky

Tech Tips
Manufacturing Cost Reduction through Automation
A step-by-step process to cut costs for a high-rel RF tuner.
by ACI Technologies

FIRST PERSON

• Caveat Lector
  Brokering a new model.
  Mike Buetow

• Talking Heads
  BBG's Greg Papandrew.
  Mike Buetow

MONEY MATTERS

• ROI
  Restating value.
  Peter Bigelow

TECH TALK

• Process Doctor
  Residues' slow burn.
  Michael McCutchen

• Defects Database
  Skipping around.
  Dr. Chris Hunt
  

• Getting Lean
  Continuous improvement plans.
  Carlos Rodriguez

• Technical Abstracts
  In Case You Missed It.

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