2009 Issues

Circuits Assembly December 2009 cover

FEATURES

  • ATE Boards
    Processes for Building Test Boards
    Test load board assembly has unique nuances and quirks that most assemblers may not properly translate.
    by Marilyn Ta

  • KeyTronicEMS
    Of Mice and Men
    In the topsy-turvey world of electronics manufacturing services, KeyTronicEMS has turned 23 straight quarterly profits. For its unique but systematic approach to the EMS rollercoaster, and its stellar performance in all types of environments, KeyTronicEMS is our 2009 EMS Company of the Year.
    by Mike Buetow

  • Paste Deposition
    Optimizing Solder Paste Printing
    Counterintuitively, the trend analysis shows keep-out distance has little or no effect on paste transfer efficiency and height for 0402 and SOP type pads.
    by the iNEMI Solder Paste Deposition Group

  • Cover Story
    PoP Assembly Process Fundamentals
    Package stacking is proving ideal for a variety of applications requiring greater functionality, higher performance and a smaller footprint: Stacking pre-tested package sections enables a high degree of flexibility for designers, permitting virtually any combination of memory to be combined with any logic chipset.
    by Vern Solberg and Phil Damberg

  • Retrospective
    In Memoriam
    A look back at friends and colleagues who left us in 2009.
    by Mike Buetow

  • Circuits Assembly 2010 Buyers Guide

FIRST PERSON

  • Caveat Lector
    Productronica productive, foretelling.
    Mike Buetow

MONEY MATTERS

  • Sherman's Market
    The near-term EMS market.
    Randall Sherman

TECH TALK

  • Screen Printing
    Practical printer/dispensers.
    Clive Ashmore

  • Selective Soldering
    Avoing cross-contamination.
    Ursula Marquez de Tino, Ph.D.

  • Wave Soldering Troubleshooting
    Wave's sizzle is no tasty sound.
    Paul Lotosky

  • The Defects Database
    Don't let microsectioning destroy the hole.
    Dr. Davide Di Maio, Ph.D.

  • Test and Inspection
    OEMs still drive test technology.
    Jun Balangue

  • Process Doctor
    Reacting to 'reactivity.'
    Harald Wack, Ph.D.

  • Getting Lean
    'Testing' Lean strategies.
    Chris Munroe

 

DEPARTMENTS

Off the Shelf

Circuits Assembly November 2009 cover

FEATURES

  • Paste Printing
    Overlooked Features of Stencil Printers
    Some PCB assemblers opt not to use vision inspection and other major stencil printer features, as well as setup process techniques. Yet several problems can occur if a vision inspection isn’t deployed.
    by Alex del Rosario

  • Cover Story
    Tin Whisker Observations
    Tin whiskers are known to be a hairy problem, with the potential to cause transient or catastrophic electrical short circuits. Here, Raytheon and industry colleagues reveal the observations and SEM images of tin whiskers captured during a series of investigations and experiments aimed at better understanding their growth, evaluating associated reliability risks, and developing mitigation techniques.
    by Robert R. Ogden and Robert F. Champaign

  • Process Control
    Minimizing Solder Paste Printing Variation
    Research into printing process factors finds the stencil blade angle affects the overall time the paste spends over the aperture, as well as the maximum filling pressure. Both characteristics have a significant effect on the resultant aperture fill.
    by George Babka

FIRST PERSON

MONEY MATTERS

  • Focus on Business
    Focused government investment can have a positive impact on business.
    Susan Mucha

TECH TALK

 

DEPARTMENTS

Off the Shelf

Circuits Assembly October 2009 cover

FEATURES

FIRST PERSON

TECH TALK

  • Screen Printing
    Combining clamping and snugging in a single board handling method.
    Clive Ashmore
  • Reflow Soldering
    Larger pads and better PCB layout will reduce strain.
    Ursula Marquez de Tino, Ph.D. and Brian Roggeman
  • Wave Soldering Troubleshooting
    If solder isn’t reaching the components, check these areas.
    Paul Lotosky
  • The Defects Database
    What look like open BGA joints might be tricks of the light.
    Dr. Davide Di Maio
  • Process Doctor
    Chemistry cleaning trials should be conducted prior to equipment selection.
    Harald Wack, Ph.D.
  • Tech Tips
    Special software permits factory floor adjustments, potentially saving capital investments.
    ACI Technologies Inc.
  • Test and Inspection
    Five ICT tools for limited access testing.
    Andrew Tek
  • Solar Technologies
    The two primary ways need more repeatable accuracy.
    Darren Brown
  • Technical Abstracts
    In case you missed it.

 

DEPARTMENTS

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