Processes for Building Test Boards
Test load board assembly has unique nuances and quirks that most assemblers may not properly translate.
by Marilyn Ta
Of Mice and Men
In the topsy-turvey world of electronics manufacturing services, KeyTronicEMS has turned 23 straight quarterly profits. For its unique but systematic approach to the EMS rollercoaster, and its stellar performance in all types of environments, KeyTronicEMS is our 2009 EMS Company of the Year.
by Mike Buetow
Optimizing Solder Paste Printing
Counterintuitively, the trend analysis shows keep-out distance has little or no effect on paste transfer efficiency and height for 0402 and SOP type pads.
by the iNEMI Solder Paste Deposition Group
PoP Assembly Process Fundamentals
Package stacking is proving ideal for a variety of applications requiring greater functionality, higher performance and a smaller footprint: Stacking pre-tested package sections enables a high degree of flexibility for designers, permitting virtually any combination of memory to be combined with any logic chipset.
by Vern Solberg and Phil Damberg
A look back at friends and colleagues who left us in 2009.
by Mike Buetow
The near-term EMS market.
Ursula Marquez de Tino, Ph.D.
Wave Soldering Troubleshooting
Wave's sizzle is no tasty sound.
The Defects Database
Don't let microsectioning destroy the hole.
Dr. Davide Di Maio, Ph.D.
Test and Inspection
OEMs still drive test technology.
Reacting to 'reactivity.'
Harald Wack, Ph.D.
'Testing' Lean strategies.
Off the Shelf
Overlooked Features of Stencil Printers
Some PCB assemblers opt not to use vision inspection and other major stencil printer features, as well as setup process techniques. Yet several problems can occur if a vision inspection isn’t deployed.
by Alex del Rosario
Tin Whisker Observations
Tin whiskers are known to be a hairy problem, with the potential to cause transient or catastrophic electrical short circuits. Here, Raytheon and industry colleagues reveal the observations and SEM images of tin whiskers captured during a series of investigations and experiments aimed at better understanding their growth, evaluating associated reliability risks, and developing mitigation techniques.
by Robert R. Ogden and Robert F. Champaign
Minimizing Solder Paste Printing Variation
Research into printing process factors finds the stencil blade angle affects the overall time the paste spends over the aperture, as well as the maximum filling pressure. Both characteristics have a significant effect on the resultant aperture fill.
by George Babka
Cleaning COTS Parts in Military Applications
Commercial off-the-shelf components are incompatible with high-rel processes.
by W. John Wolfgong, Ph.D.
Best Practices in Contract Manufacturing
Though different in size and scope, these six companies have long track records of success.
by Randall Sherman, Dave Leone and Frank Klomp
Connector technology still grapples with smaller platforms, higher speeds and placement issues.
by John MacWilliams
Anatomy of a Correct Thermal Profile
Complex, BGA-laden PCBs demand one-of-a-kind profiles.
by Simon Ilustre
EMS Service Trends
Trends In Prototyping Service Needs
What drives them and how can design teams optimize the process?
by Duane Benson