2009 Issues

Circuits Assembly August 2009 cover

FEATURES

  • Cover Story
    Preventing MLCC Failures
    Mechanical anomalies can cause electrical failure in MLCCs. Many defects - including cracks caused by panel separation - can be uncovered by first performing acoustic imaging on unassembled parts.
    By Tom Adams

  • Reflow Profiling
    Oven Adjustment Effects on a Solder Reflow Profile
    A recipe that works for one board won't necessarily work for another board if the weight or design is significantly different. This study found that of the three oven adjustments, zone set points have the biggest effect on peak temperature and TAL.
    By Fred Dimock

  • Cover Story
    More than Just a Look
    SPI market leader Koh Young is shrugging off the recession and taking Europe head on. Circuits Assembly visits the OEM to learn why now, and to get an in-depth look at its new 3-D AOI machine.
    By Mike Buetow

FIRST PERSON

  • Caveat Lector
    The estimable legacy of iNEMI CEO Jim McElroy.
    Mike Buetow

TECH TALK

 

DEPARTMENTS

Industry News
Market Watch
Product Spotlight
Ad Index
Assembly Insider

On the Cover:An acoustic image of an MLCC containing a single void.

 

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FEATURES

  • Buyers Guide
    2009-10 Circuits Assembly Buyers Guide
    Our annual guide to suppliers of equipment, materials and services for electronics assembly.

  • Cover Story
    A Novel Six Sigma SnPb Solder Paste
    Although Six Sigma principles have been used in the industry for years, for the most part they have been applied to PWB fabrication or assembly processes – not to product development, and certainly not to soldering materials themselves. The recent development of a new SnPb solder paste, however, combined modern raw materials and the application of these principles.
    By Steve Ratner, Martin Lopez, John McMaster, Frank Murch and Mike Skrzat

FIRST PERSON

  • Caveat Lector
    The EMS sector's ongoing profit problem.
    Mike Buetow

MONEY MATTERS

  • Talking Heads
    Sanmina-SCI’s Sundar Kamath talks alternative energies.
    Mike Buetow
  • Focus on Business
    How program managers can beat the recession.
    Susan Mucha

TECH TALK

  • Screen Printing
    The effect of printing and reflow on broadband boards.
    Dr. Rita Mohanty
  • Reflow Soldering
    When wetting rears its ugly head, check for missing pads.
    Ursula Marquez de Tino
  • Materials World
    Mitigating tin whisker risks through conformal coatings.
    Dr. Renzhe Zhao

 

DEPARTMENTS

Industry News
Market Watch
Product Spotlight
Ad Index
Assembly Insider

On the Cover:A new approach to solder paste development gets rid of "trial and error"

Circuits Assembly September 2009 cover

FEATURES

  • Cover Story
    Research on Ionic Cleanliness Testing Alternatives to IPA/Water
    A study of alternative solvent mixes was undertaken to establish whether IPA-water mix could be improved. Following a down-selection of potentially suitable solvents, the mixes were applied to commonly available flux residues. The revelation: IPA water is limited as a cleaner and should not be a standard for analytical extraction tests.
    by Harald Wack, Ph.D., Syed Ahmad and Joachim Becht, Ph.D.

  • iNEMI Roadmap
    Information Management Gaps for Board Fabrication and Assembly
    Within board fabrication and assembly, improvements in information management are needed in several areas. The link between design and manufacturing, part traceability, and PWB systems all have new needs that can be addressed by improved systems.
    by Eric Simmon

  • Leda Corp.
    Aerospace Design and Assembly in Surf City USA
    When Boeing needs prototype assemblies, it jets on down to Leda Corp. With a new building and equipment set, Leda is preparing to take off.
    by Chelsey Drysdale

  • Chip Packaging
    3-D IC Bonding
    Supply-chain roles are changing, with EMS firms expected to take a bigger chip-packaging role. New 3-D ICs provide an opportunity to expand services. Here's a look at how these packages are bonded, including the advantages and limitations of each technology.
    by Chris Sanders

FIRST PERSON

MONEY MATTERS

  • Global Sourcing
    The supply chain works best when diligence and consistency rule the relationships.
    Charlie Barnhart
  • Focus on Business
    Ramping EMS sales efforts.
    Susan Mucha

TECH TALK

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