Preventing MLCC Failures
Mechanical anomalies can cause electrical failure in MLCCs. Many defects - including cracks caused by panel separation - can be uncovered by first performing acoustic imaging on unassembled parts.
By Tom Adams
Oven Adjustment Effects on a Solder Reflow Profile
A recipe that works for one board won't necessarily work for another board if the weight or design is significantly different. This study found that of the three oven adjustments, zone set points have the biggest effect on peak temperature and TAL.
By Fred Dimock
More than Just a Look
SPI market leader Koh Young is shrugging off the recession and taking Europe head on. Circuits Assembly visits the OEM to learn why now, and to get an in-depth look at its new 3-D AOI machine.
By Mike Buetow
On the Cover:An acoustic image of an MLCC containing a single void.
2009-10 Circuits Assembly Buyers Guide
Our annual guide to suppliers of equipment, materials and services for electronics assembly.
A Novel Six Sigma SnPb Solder Paste
Although Six Sigma principles have been used in the industry for years, for the most part they have been applied to PWB fabrication or assembly processes – not to product development, and certainly not to soldering materials themselves. The recent development of a new SnPb solder paste, however, combined modern raw materials and the application of these principles.
By Steve Ratner, Martin Lopez, John McMaster, Frank Murch and Mike Skrzat
On the Cover:A new approach to solder paste development gets rid of "trial and error"
Research on Ionic Cleanliness Testing Alternatives to IPA/Water
A study of alternative solvent mixes was undertaken to establish whether IPA-water mix could be improved. Following a down-selection of potentially suitable solvents, the mixes were applied to commonly available flux residues. The revelation: IPA water is limited as a cleaner and should not be a standard for analytical extraction tests.
by Harald Wack, Ph.D., Syed Ahmad and Joachim Becht, Ph.D.
Information Management Gaps for Board Fabrication and Assembly
Within board fabrication and assembly, improvements in information management are needed in several areas. The link between design and manufacturing, part traceability, and PWB systems all have new needs that can be addressed by improved systems.
by Eric Simmon
Aerospace Design and Assembly in Surf City USA
When Boeing needs prototype assemblies, it jets on down to Leda Corp. With a new building and equipment set, Leda is preparing to take off.
by Chelsey Drysdale
3-D IC Bonding
Supply-chain roles are changing, with EMS firms expected to take a bigger chip-packaging role. New 3-D ICs provide an opportunity to expand services. Here's a look at how these packages are bonded, including the advantages and limitations of each technology.
by Chris Sanders