Press Releases
WATERBURY, CT – MacDermid Alpha, one of the world’s largest providers of solutions for circuitry, assembly, and semiconductor manufacturers within the electronics industry will present its latest research on high-speed copper plating at the 19th Annual Device Packaging Conference (DPC 2023), held March 13-16, at the We-Ko-Pa Conference Center in Fountain Hills, Arizona. Engage the industry experts at booth 31-32, where MacDermid Alpha will showcase the performance benefits of advanced materials for die attach, chip fabrication, and wafer-level packaging.
Sean Fleuriel, Research Chemist, will present a paper at the technical conference, titled “High-Speed Copper Plating Process for IC Substrate”. In this paper, Sean presents findings from an acid copper electrolyte utilized for plating 2-in-1 redistribution layers (RDL), with small vias and fine lines down to 10µm wide. The electrolytic process successfully plated these features, while maintaining a uniform surface across the panel that met the demanding physical requirements for IC substrate applications. Sean will explore the new high-speed findings in greater detail, revealing new degrees of control unavailable in VCPs, and cover the benefits of the high-speed tool to reduce plating time.
MacDermid Alpha is powering the future of advanced semiconductor solutions that exceed demanding packaging design requirements and help overcome the challenges of miniaturization thereby enabling greater device reliability. Highlighted at the show will be:
- Systek ®, MacDermid Alpha’s family of high-performance build-up processes for IC Substrates and their integrated leadframe package portfolio which spans the entire process of building QFN packages from leadframe roughening and improving sidewall solderability for enhanced reliability to selective EMC plating for higher functionality.
- NOVAFAB ® NANOTWIN Cu is a ready-to-use, high-purity copper electroplating process designed for use with soluble or insoluble anodes. This system enables low-temperature, high-reliability copper- to-copper interconnects for die-to-die (D2D), die-to-wafer (D2W), and wafer-to-wafer (W2W) bonding.
Additionally, for solutions designed for the challenges of power electronics, MacDermid Alpha will share information on the latest capabilities of the ALPHA ® ARGOMAX ® portfolio of sinter materials and ATROX ® conductive and non-conductive die attach pastes and films will be available. ALPHA ® ARGOMAX ® engineered sinter materials are proven to have the best process times and reliability while providing flexible and easy-to-use form factors that reduce the capital cost and time to market. ATROX ® conductive die attach products are an enabler for package shrinkage and higher power density packaging, designed for excellent workability and processing, and offer proven performance across a range of exposed pad power packages.
Let’s start a conversation at booth 31-32; the team from MacDermid Alpha will be ready to discuss how to elevate your process with an integrated ‘start to finish’ roadmap featuring some of the most advanced technologies on the market, backed by extensive R&D facilities, a robust supply chain, and extraordinary customer service. Established brands aligned under MacDermid Alpha Electronics Solutions include Alpha ® , Compugraphics, Electrolube ® , Kester ® , and MacDermid Enthone ® . MacDermid Alpha will resolve your pain points today, tomorrow, and beyond. Discover how we make a difference by visiting www.macdermidalpha.com
GAINESVILLE, GA ― Count On Tools, Inc. (COT), a leading provider of precision components and SMT spare parts, manufactures RPS Automation Selective Solder Risers for the Opus range of selective soldering machines. The nozzles are machined from special alloy steel with N65 magnets. The easy drop-in replacements are designed for long-lasting, dependable performance.
As selective soldering continues to become more popular in the electronics manufacturing industry, Count On Tools has realized the need for higher quality selective solder nozzles that can consistently apply flux and solder to component leads without disturbing nearby SMT components. Count On Tools custom selective solder nozzles assist to replace labor-intensive hand soldering while eliminating defects caused by wave soldering machines in the market’s most popular selective soldering equipment.
Additionally, Count On Tools offers custom selective solder nozzles based on specific application requirements. This includes special wave form sizes and extended or shortened lengths. Generally, these nozzles can be completed in 3-5 days with savings up to 50 percent less than OEM nozzles.
Being a one-stop shop, the company strives to offer the widest range of SMT nozzles and consumables as possible. All COT products are NEW and meet or exceed all OEM specifications. COT parts are a direct replacement, ultimately saving over buying directly from the OEM.
Count On Tools is a leading provider of precision machined components, SMT spare parts and Swiss-made hand tools, locally and globally. The company has won numerous awards for its quality products and service. Count On Tools holds and maintains current ITAR registration, 07FFL, 02SOT, and a first-class Quality Management System. For assistance with SMT needs or quotes for in stock items, contact sales@cotinc.com
COHOES, NY – PVA, a global supplier of automated dispensing and coating equipment, today announced plans to exhibit at The ASSEMBLY Show South, scheduled to take place April 4-6, 2023 at the Music City Center in Nashville, TN. The PVA team will highlight the Valve Tool Changer in Booth #553.
The ASSEMBLY Show has been a staple in the industry for 10 years, and now the organizers are bringing the show to the U.S. South, where manufacturing is growing and thriving at an unprecedented rate. Join PVA in Nashville, TN and connect face-to-face with like-minded peers, learn from business thought leaders, and uncover emerging trends and technologies related to assembly technology equipment and products.
PVA’s new Valve Tool Changer feature increases the number of applications each machine can satisfy without sacrificing valuable work area. The Tool Changer can accommodate four additional valves in the machine that can be automatically picked up and used at any time.
PVA is a world-class innovator of high quality, repeatable dispensing and conformal coating systems. The company manufactures turnkey solutions that help customers improve their competitiveness, such as coating inspection, optical bonding and curing ovens.
The PVA team will be available to answer questions about coating and dispensing, as well as other application solutions in the PVA line-up such as coating inspection, optical bonding and curing ovens.
For more information about PVA, please contact PVA at info@pva.net or (518) 371-2684.
BILLINGSTAD, NORWAY – Kitron has received an order with a value of more than NOK 180 million from Kongsberg Defence & Aerospace (KONGSBERG).
The order is for military tactical communications equipment for the defence market developed and produced by KONGSBERG.
“Electronics for advanced communications equipment constitutes a key part of Kitron’s business within the defence market, and we see solid growth in this segment. Therefore, we are extremely pleased to receive this order from KONGSBERG,” said Hans Petter Thomassen, Managing director of Kitron Norway.
Deliveries will start in 2024 and continue into 2025. Production will take place at Kitron’s facility in Arendal, Norway.
MANASSAS, VA – ZESTRON, is pleased to announce that Senior Application Engineer, Ravi Parthasarathy, will present a technical study, "Defluxing of Copper Pillar Bumped Flip Chips" at the International Microelectronics Assembly and Packaging Society’s (IMAPS) Device Packaging Conference on Tuesday, March 8th. His presentation is part of the Fan-Out, Wafer Level Packaging & Flip Chip Track Session TP2: WLP & Flip Chip: Process & Materials (2:00 – 5:30 pm)
In comparison to wire bonding technology, flip chip technology provides higher packaging density (more I/Os), higher performance (shorter possible leads, lower inductance), smaller device footprints and lower packaging profile. Copper Pillars are likely to become the most dominant type of flip chip interconnect in the coming years because they allow for pitches down to 40µm as well as improved electrical performance. However, post-solder flux residues can affect reliability and underfill, leading to delamination and voids. “Our study focuses on the impact of flux cleaning using straight de-ionized water and novel low-concentration aqueous cleaning agents on copper pillar bumped flip chips. The benchmark established in this study helped with Phase II study involving bump pitches lower than 15µm and denser packages. We are excited to present our findings at the IMAPS 19th Device Packing Conference” said Ravi Parthasarathy.
ZESTRON is a leading provider of cleaning solutions for the semiconductor industry focusing on advanced packaging including stacked copper pillar, FOWLP (2.3D/2.5D/3D) and and fCBGA packages. With ZESTRON’s cutting-edge technologies and experienced team of engineers, ZESTRON offers innovative and reliable cleaning processes for power electronics, advanced packaging, and wager bumping processes.
To learn more about ZESTRON’s capabilities within the Semiconductor industry, click here to download informational flyers: https://pages.zestron.com/semiconductor-flyers
WASHINGTON – A U.S. Semiconductor Industry Association delegation (SIA) will travel to Xiamen, China for the 75th World Semiconductor Council Joint Steering Committee (JSTC) meetings from March 7-10. The meetings will include our industry counterparts from China, Chinese Taipei, the EU, Japan, and Korea. This will be SIA’s first trip to China since the start of COVID and represents an important opportunity to discuss shared industry concerns about recent issues relating to trade, global supply chain, government support, environmental, and other developments.
The semiconductor industry is one of the most globally integrated industries, spanning dozens of nations with thousands of suppliers. As a result, semiconductors are the fourth-most traded good with nearly $1.5 trillion in annual trade flows. While the United States is rightly focused on supply-chain resilience and rebuilding our industrial base with the passage and enactment of the CHIPS Act, as U.S. Secretary of Commerce Gina Raimondo recently stated,[1] the U.S. can never be fully self-sufficient. This means access to global markets and supply chains is integral to the future success of the U.S. semiconductor industry. In fact, more than 80% of all U.S. semiconductors are sold overseas, meaning the new fabs and jobs created with support from the U.S. CHIPS Act will need greater access to global markets to be financially viable and globally competitive. SIA and its members are committed to both rebuilding American supply chains while further promoting more access to global markets and facilitating increased global trade through deeper international collaboration with all key partners and nations.
Essential to this mission is the World Semiconductor Council (WSC).[2] Established in 1996 as a forum for the world’s key semiconductor-producing nations and regions, its role is to help coordinate industry and government initiatives and policies to ensure our industry remains healthy. Few industries have such a body, and from day one, the WSC has been a shining example of our industry’s commitment to international cooperation and policies that foster fairness and openness in the semiconductor industry. For example:
- The WSC has successfully promoted a tariff-free global environment for the trade of semiconductor products, successfully adding Multi-Component and Multi-Chip and Multi-Component packages (MCOs and MCPs) to the WTO’s Information Technology Agreement.
- On the environmental front, the WSC was recognized by the U.S. Environment Protection Agency (EPA) as part of its first Climate Protection Award, in recognition of the semiconductor industry’s efforts to commit to significant reductions in emissions of greenhouse gases used in the semiconductor manufacturing process. Under the umbrella of the WSC, the global industry has exceeded its initial 10% reduction goal for perfluorocarbons (PFC) emissions and achieved a 32% decrease over a ten-year period.[3]The WSC also coordinated efforts of the global industry to eliminate the use of PFOS, a chemical of concern previously used in semiconductor manufacturing, and in efforts to phase out the use of another chemical, PFOA.
- Most recently, the cooperation among WSC members was critical to keeping semiconductor operations up and running during COVID forced closures. All six WSC members swiftly signed three COVID-related global industry statements, having real, meaningful impact to convince governments around the world to designate our sector as “essential.”
These are just a few examples of how the strong relationships and trust built through the WSC have helped our industry prosper. As we look to the future, SIA remains committed to working with our counterparts in China, Chinese Taipei, Japan, Korea, and Europe through the WSC and GAMS to establish a vibrant global policy and innovation ecosystem for our industry and ensure the world continues to reap the benefits of innovative solutions to any future challenges.
Next week’s JSTC meeting will tee up the work for the CEO-level WSC meeting, which will take place in May this year in Seoul to prepare detailed policy recommendations to their governments for the annual Government Authorities Meeting on Semiconductors (GAMS). The U.S. will then host the 2023 GAMS meeting in Phoenix, Arizona this October. The WSC and GAMS are invaluable forums, unmatched by other sectors, providing a unique opportunity for our industry to convey the importance of cooperation and explore areas of mutual interest with our governments and authorities.
With global trade tensions on the rise, there is an urgent need for government policies that support open markets, innovation, and secure and resilient global supply chains. We look forward to continuing to pursue these policies alongside our global counterparts at next week’s JSTC meeting in Xiamen.
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