JASPER, IN – Kimball Electronics, Inc. (Nasdaq: KE) today announced the release of its 2022 Environmental, Social & Governance (ESG) Report, themed "Poised to Make an Impact," highlighting the Company’s ongoing efforts to operate sustainably and responsibly in calendar year 2022.

The Company’s annual ESG report provides an in-depth analysis of Kimball Electronics’ ESG initiatives, including the many examples of how the Company demonstrates its purpose of Creating Quality for Life in its communities through positive environmental and societal impacts and projects. Some of the achievements for calendar year 2022 included the following:

• A 36% reduction in greenhouse gas emissions since 2014
• A 26% reduction in air emissions since 2014
• Donations of over $330,000 in time and money toward worthy causes worldwide
• The adoption of globally recognized ESG reporting standards

"We want our reporting to show how we proactively address challenges both in our business and to our stakeholders, and that we recognize the connection between significant ESG issues and the long-term value we deliver to Share Owners," stated Don Charron, in the report’s CEO Message to stakeholders.

Mr. Charron, who retired February 28, 2023, and was succeeded by Ric Phillips, penned the ESG message as one of his last public letters as the Company’s top executive, a fitting farewell since the report covers happenings during his last full calendar year of leadership.

The latest report also demonstrates both the Company’s decision to strengthen its ESG disclosures and the importance of ESG in its business strategy and global operations.

"This year represents a milestone for Kimball Electronics," said Doug Hass, Chief Legal & Compliance Officer. "The standardization of our ESG data disclosures helps us to build trust with those who use our data to make more informed decisions about us. All of these sustainability efforts help us meet our stakeholder needs, regulatory requirements, and DEI&B goals; contribute to the prosperity and quality of life of our global community; and deliver long-term, sustainable profits for our Share Owners."

The full version of the 2022 ESG Report at www.kimballelectronics.com/esg includes ESG reporting that complies with the Sustainability Accounting Standards Board’s Electronic Manufacturing Services & Original Design Manufacturing standard and the Task Force on Climate-Related Financial Disclosures. It also documents how the Company’s ESG priorities align with and support the United Nations Global Compact’s Ten Principles and the UN Sustainable Development Goals. The Company will also make the 2022 ESG Report available in an interactive format.

SAN JOSE, CA – Green Circuits, a full-service Electronics Manufacturing Services (EMS) partner to leading OEMs, today announced the appointment of Mark Evans as Chief Operating Officer (COO). With more than 34 years of industry expertise, Evans brings energy, enthusiasm and experience to Green Circuits’ operations and supply chain.

An industry veteran, Evans began his career at Flextronics in 1989 as a Process Engineer, after studying Electrical Engineering at the University of Glamorgan in the UK. He went on to earn his BS in Business Management from the University of Phoenix, Kaizen Certification, Black Belt certification in both Lean and 6 Sigma.

Evans has experience overseeing production, quality, engineering, materials, HR and document control teams. In a previous role, he drove the revenue rate from $17 million to $100 million in just two years. Additionally, he has experience integrating major acquisitions.

Green Circuits specializes in quick-turn prototypes, new product development, and early-stage production to speed customer product launch. The spectrum of markets served includes defense, medical, robotics, automation, satellite, automotive and aerospace.

Green Circuits provides high-quality design, prototyping and full-scale production services for all types of printed circuit boards and complex systems. For more information, visit www.greencircuits.com 

AUSTIN, TX – High Density Packaging (HDP) User Group announces the Jack Fisher Technical Excellence Award to honor the memory of Jack, who passed away on January 20, 2023.

Jack served as an HDP Facilitator for more than 18 years and was a major contributor to the growth of HDP over the course of his tenure. “Jack was a printed circuit board industry icon, which was recognized by his election to the IPC Hall of Fame in 2006. His expertise and experience will be missed by members and staff alike”, said Larry Marcanti, Executive Director of HDP User Group.

The Jack Fisher Technical Excellence Award will be awarded to HDP members who best exemplify the standards set by Jack over the course of his stellar career.

The eulogy given by Larry can be seen here: https://youtu.be/lZGMvZP5FDU 
Jack’s obituary: https://www.pressconnects.com/obituaries/bps136484 

NUREMBERG – True to its motto "Driving manufacturing forward", the SMTconnect taking place from 9 – 11 May in Nuremberg, Germany, will offer the European electronic production community a forum for inspiration and exchange as a basis for the further development of key technologies for the future.

Two months before the exhibition will open its doors, numerous well- known key players in the industry, including ASYS, Ersa, Essemtec, FUJI, JUKI, Panasonic, SMT Wertheim and Viscom, have confirmed their participation as exhibitors. They will present products and solutions from all areas of electronics manufacturing at the Nuremberg exhibition grounds, and exchange ideas on current industry issues such as increased energy costs, component and raw material shortages and obsolescence management, as well as the current re-shoring trend to Europe with peers and practitioners.

Highlights of the event once again include IPC’s hand soldering competition for young professionals as well as the Future Packaging production line presented by Fraunhofer IZM, this year on the topic of "Trust the Line" - Competitiveness through Trust, Sustainable Tool and Supply Chain.

The topic of supply chains will also be addressed at the "EMS Park" special showcase area. Offering impulse and best practice presentations (e.g. from Uhlmann & Zacher on the topic of EMS selection, specification creation and collaboration), this will highlight the benefits of close collaboration between EMS providers and OEMs for both sides and provide a platform for personal exchange that builds trust to delegate development issues and optimize the supply chain. Among other EMS companies, Assel, Elhurt and Coronex are participating, presentation topics include “The power of trust and dedication – Elhurt EMS way of navigating through components shortage reality” (Elhurt) as well as a number of relevant German-language contributions.

Furthermore, the "PCB meets Components" joint booth enjoys a high level of participation, with Würth Elektronik among the exhibiting companies.

With contributions on current topics such as "Operating AI use cases integrated into electronics manufacturing lines" (Dr. Sebastian Mehl, Siemens AG) on May 10 and the topics "Promoting young talent" and "Women in mechanical engineering - change in the company" on May 11, the trade fair forum promises an exciting program. This year, in addition to the ZVEI and Fraunhofer IZM, the VDMA and the German Association for Electronics Design & Manufacturing, FED e.V., are also participating, each with several program items.

Further information on the exhibition, topics and exhibiting companies is available at smtconnect.com. Interested parties are encouraged to purchase their tickets in advance via the event website.