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Press Releases

CLINTON, NY – As one of the industry’s foremost providers of Au-based products, Indium Corporation® will proudly feature its high-temperature and high-reliability gold solder solutions at the International Conference and Exhibition on High Temperature Electronics (HiTEC), hosted by IMAPS, in Albuquerque, New Mexico, April 18-20. Among its featured Au-based products, Indium Corporation will showcase its AuLTRA™ ThInFORMS™—0.00035” thick (0.00889mm or 8.89μm) 80Au/20Sn preforms.

As a leading gold solder innovator, Indium Corporation’s gold-based portfolio includes wire, paste, preforms, spheres, shot, and ribbon manufactured with cutting-edge technology to ensure supreme quality and the utmost precision. The most commonly used gold-based alloy is 80Au/20Sn; it is the pillar alloy of the microelectronics industry with a melting point of 280°C and works exceptionally well in the majority of die-attach and lid sealing applications. It exhibits good thermal fatigue properties and is used in many applications that require high tensile strength and high corrosive resistance. Indium Corporation’s AuSn solder offers numerous benefits including:

  • Highest tensile strength of any solder
  • High melting point compatible with subsequent reflow processes
  • Superior thermal conductivity
  • Resistance to corrosion

An excellent choice for die-attach applications, AuLTRA™ ThInFORMS™ improve the overall operational efficiency of high-output lasers. They help combat issues such as:

  • Shorting—reduced solder volume inhibits wicking up the die, minimizing the risk of shorting
  • Poor thermal transfer—the ultra-thin 0.00035” preform reduces bondline thickness (BLT), thus improving thermal transfer and increasing the longevity and performance of the device

To learn more about Indium Corporation’s Au-based solutions, visit https://www.indium.com/products/solders/gold/ or stop by our booth at HiTEC.

SALT LAKE CITY, UT – Sarcos Technology and Robotics Corporation (“Sarcos”) (NASDAQ: STRC and STRCW), a leader in the design, development and manufacture of advanced robotic systems that redefine human possibilities, is collaborating with Jabil Inc., a leading manufacturing solutions provider, to expand Sarcos’ production capacity for its robotic systems and sub-systems.

Under the terms of the agreement, Sarcos will utilize Jabil’s broad manufacturing services to produce a variety of leading-edge robotic systems and sub-systems. Sarcos also will be able to leverage Jabil’s global footprint, strategic supplier relationships, and state-of-the-art manufacturing facilities to accelerate volume production while benefiting from advanced supply chain, procurement, and component-sourcing solutions.

“We expect that our relationship with Jabil will advance Sarcos’ manufacturing capabilities tremendously, helping to augment our overall production capacity and enabling us to scale much faster than we could without their support,” said Kiva Allgood, president and CEO, Sarcos. “We are excited to work with a proven manufacturing services leader that has a long-standing record of success and an established global network of vendors and partners as we begin delivering our robotic systems to our customers.”

Sarcos expects to increase the production of its commercial robotics technologies throughout 2023, with manufacturing and assembly occurring at a combination of Sarcos’ facilities in Salt Lake City and Pittsburgh, as well as Jabil’s San Jose, California-based production site. Sarcos anticipates that Jabil will primarily produce sub-systems for Sarcos’ commercial products this year, particularly the Guardian® XT™ dexterous robotic system and may also include the Guardian® XM intelligent robotic system and Guardian® Sea Class Robotic System. In 2023, final system assembly is expected to take place at Sarcos facilities.

“Jabil is pleased to provide our value-added manufacturing services, which we are confident will expand Sarcos’ overall production capacity in a highly cost-effective and efficient manner,” said Craig Trotter, vice president of the capital equipment business unit, Jabil. “Our deep expertise in materials science, mechanical assembly, and human-machine interfaces, along with final assembly and test, will prove pivotal in accelerating world-class production of Sarcos’ industry-leading robotic systems and sub-systems.”

BROMONT, CANADA – Cogiscan, factory digitalization experts for electronics manufacturers globally, is proud to announce new distribution partnerships with MacTech for technical sales support and representation in Argentina.

"Adding MacTech to our distribution network is truly exciting. They have an excellent reputation in a key geographic region for us, Argentina – plus, they’re passionate about our industry and take a technology forward approach to working with customers."
Nirav Jariwala, Sales Application Engineer at Cogiscan

MacTech re-sells a wide range of SMT solutions for electronics manufacturers within Argentina – covering all aspects of the production process from SMT machines to consumables to intelligent software. Focused on production efficiency, they collaborate closely with their customers.

"Our clients are increasingly concerned about the shortage of materials due to both global problems and particular conditions in our country. We believe that Cogiscan will help our industry to manage inventory control more efficiently, assigning the correct materials and updating stocks in real time. Cogiscan, with its complete line of solutions, will drive our clients towards industry 4.0 with the digitization of the production floor."
Emiliano Herrero, Sales Director at MacTech

HERTFORDSHIRE, UK – In a first of its kind for the sector, the International Tin Association (ITA) has launched its strategic report – TIN2030: A Vision for Tin. This thought-leading initiative has been compiled in collaboration with a broad range of stakeholders from across the sector. Identifying both opportunities and challenges, it highlights the crucial role of tin as a resource to enable the global energy transition and digitalisation. There will be new opportunities to work together on ESG issues to underpin supply.

“Looking into the next decade, the tin industry faces dramatic new market dynamics and ESG demands. It is important for us in the sector to understand what lies ahead so we can take advantage of the unprecedented opportunities and challenges”, said Helen Prins, CEO of ITA. “We foresee that the next decade will see a wakeup to tin with a new wave of efforts to secure a sustainably sourced supply.”

The report highlights the impact of global changes on the sector. Changes such as rising geopolitical tensions, climate change urgency and macroeconomic shocks. According to the ITA research, this will lead to increased competition for vital resources including tin. Tin supply chains will need to adapt rapidly to meet these challenges while also working together to manage increased ESG expectations and demonstrate how the tin sector is building a better future for everyone.

The report highlights the importance of tin to everyday life and its growing role as an essential enabler for the energy transition and digitalisation. As the glue that holds together almost all electronic and electrical infrastructure, its significance will increase. Another strong indication that the demand for tin will surge. ITA estimates that $1.4 billion is needed to deliver 50,000 tpa more tin by 2030.

Better communication and collaboration on ESG will be needed to develop a holistic understanding of risks and meaningful standards. Increased engagement with ASM will increase business opportunities and rewards. The market will differentiate companies who strive beyond minimum requirements, including those achieving UN 2030 SDG’s.

TIN2030 represents a landmark effort in terms of bringing the industry together to think about the future of the sector. A pioneering effort led by ITA in its unique position at the heart of the industry. Through this holistic approach, ITA has been able to integrate perspectives from across the sector to best understand what the future is likely to hold for this vital metal.

More information on tin use is available on the ITA website: www.internationaltin.org 

WASHINGTON DC – The recent partnership announced by the U.S. and Canada is a welcome acknowledgement of the urgent need to support the American printed circuit board industry. The Presidential determination of printed circuit boards as essential to national defense under section 303 of the Defense Production Act is welcome news, and achieves a 2023 goal of the Printed Circuit Board Association of America (PCBAA).

The $50 million identified is a downpayment on what must be a larger and sustained effort by the U.S. government to rebuild this critical manufacturing sector. The American printed circuit board industry was decimated by offshoring over the past 20 years, dropping from almost 30 percent of the world’s supply to only 4 percent today. The U.S. depends on other nations -- primarily in Asia, and more than half from China.

“We are eager to work with the Administration to make the best use of this and advocate for subsequent funding for this long-overlooked industry”, said Travis Kelly, Chairman of the Printed Circuit Board Association of America and President and CEO of the Isola Group. “The costs of creating new facilities or upgrading existing printed circuit board facilities can run into hundreds of millions. Just as legislation and policies were created to support semiconductors, the U.S. government needs to invest in our nation’s future by providing support for printed circuit boards.”

NEWMAN LAKE, WA – Hentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, announces that it has published a technical paper describing the suggestion that electronic manufacturers should implement automated selective soldering as opposed to using manual soldering. This technical paper encompasses critically important information and is entitled “Achieving Greater Through-Hole Soldering Reliability Without Sacrificing Throughput.” This 5-page tech paper outlines essential information for circuit board assembly processes and can be downloaded by visiting www.rpsautomation.com/news/technical-papers.

Topics covered within this publication include soldering methods, manual soldering, hand soldering reliability, process considerations, versatility vs. throughput, fluxing control, process repeatability, and selective soldering system flexibility.

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