SON, NETHERLANDS – Neways, the global innovator in mission-critical technology for leading semicon, connectivity and smart mobility companies, has onboarded Saab as new customer. Saab is a leading defense and security company constantly pushing the boundaries of technology to create a safer and more sustainable world.

Neways will support Saab with the delivery of various vision and optics related products for defense vehicles. Neways’ products include video displays, display oculars, accelerometers and various specialized cable harnesses. Deliveries under the multiyear contract will take place out of Neways’ production facility in Slovakia. Here Neways is currently also constructing a new 22,000 m2 state-of-the-art production facility that can support in further ramping up volumes in the future.

Neways will support Saab throughout the lifecycle of its products. High quality products, deep understanding of technology, professionalism of the organization and the ability to grow along with Saab where important selection criteria for Saab in selecting its partner.

Hans Büthker, CEO of Neways, comments: “I am proud that Neways is selected by Saab as supplier of complex electronics. We will make our full spectrum of services available: from design, initial prototyping, at-scale production, testing, all the way to service and repair. Our new large-scale production facility in Slovakia is perfectly set-up to deliver on these capabilities and support Saab in its further growth.”

SAN JOSE, CA – Today marks a significant milestone in the evolution of open, cloud, and AI-driven networking technologies, as Aviz Networks, a leader in providing Open Source based networking solutions for SONiC and GenAI, joins forces with Celestica Inc. (TSX: CLS) (NYSE: CLS), a global leader in design, manufacturing, and supply chain solutions. This collaboration aims to streamline and support SONiC-based network deployments, offering customers unprecedented control and flexibility at the fabric level.

Celestica, renowned for its expertise in compute and connectivity solutions, excels in delivering high-reliability designs that meet the sophisticated needs of Artificial Intelligence (AI), Machine Learning (ML), and high-performance computing. Through this partnership, Aviz Networks' ONES will integrate seamlessly with Celestica's advanced Ethernet solutions, providing a comprehensive networking package that is ready to deploy and comes with 24x7 and 30-minute SLA support.

This partnership empowers enterprises with the tools to efficiently manage SONiC networks, leveraging advanced visibility, orchestration, and automated support capabilities. It facilitates diverse applications of SONiC on Celestica switches, covering Data Centers, Edge Networks, and AI Fabric utilizing RoCE deployments. The partnership underscores both companies' commitment to delivering superior SONiC solutions, merging Celestica's hardware prowess with Aviz's innovative software stack.

"Celestica is thrilled to partner with Aviz Networks, reinforcing our mutual dedication to expanding the capabilities and success of open source cloud networks through the power of SONiC. This partnership is set to elevate customer support, enabling them to optimize their networks with AI-driven automation and insightful data analytics," expressed Mini Shah, VP Software Engineering for Platform Solutions, Celestica.

Vishal Shukla, founder and CEO of Aviz Networks, highlighted the significance of the collaboration, stating, "The addition of Celestica to the Aviz ecosystem introduces a new dimension of innovation and comprehensive solutions that cater to the edge, AI, and data center networking needs. Together, we're set to redefine the economics of hyperscale networks, simplifying operations and enhancing AI-managed functionalities for our customers."

NASHVILLE – KYZEN, the global leader in innovative environmentally friendly cleaning chemistries, announced today that KYZEN’s Director of Science, Adam Klett, PhD will present as a keynote speaker at the SMTA Electronics in Harsh Environments Conference. The event is scheduled to take place May 14-16, 2024 at the Technical University of Denmark in Copenhagen, Denmark.

Klett will present “The Effect of Cleanliness on the Linearity of the Current Response of Standard SIR Patterns at High Voltages,” at 1:30 PM on Thursday, May 16, serving as the keynote address of the third and final day of the conference.

The keynote presentation is summarized as the following: Surface insulation resistance (SIR) is a well-established technique for the detection of ionic contamination of PWB coupons that applies a 5V bias to an interdigitated comb pattern and measures the current response in order to calculate the surface resistance of the sample. Certain applications, e.g., automotive, have high-voltage circuits that require SIR testing, but the question has been posed, “Does the current standard of 5V apply in these applications?”

In “The Effect of Cleanliness on the Linearity of the Current Response of Standard SIR Patterns at High Voltages,” the linearity of the current response of both clean and contaminated SIR coupons are characterized at high voltages in order to understand the relationship between contamination and test voltage and the measured SIR response. This will help steer the development of better test methods and acceptance criteria for SIR in high-voltage applications.

The SMTA Electronics in Harsh Environments Conference, hosted by SMTA Europe, addresses the wide variety challenges and best practices for design and manufacturing of electronics devices to preform reliably when used in harsh environments. The 2024 conference features three full days of technical programming including a keynote presentation each day.

For more than 30 years, KYZEN and the industry-leading Clean Team, including Klett, have remained dedicated to providing solutions to unique electronic cleaning challenges. For more information, visit www.kyzen.com 

CLINTON, NY – As an industry leader in innovative materials solutions for semiconductor packaging and assembly, Indium Corporation® will feature its advanced products designed to meet the evolving challenges of heterogeneous integration and assembly (HIA) and fine-pitch system-in-package (SiP) applications at the 74th Electronic Components and Technology Conference (ECTC), May 28‒31, in Denver, Colorado.

Indium Corporation’s proven SiPaste® series is specifically designed for fine feature printing with fine powders ranging from Type 5 to Type 8. They help Avoid the Void®, reduce slumping, and demonstrate consistent superior printing performance. Indium Corporation’s SiPaste® C312HF is a new formulation offering the same excellent printing performance and material stability over time, with the benefit of having an easily cleanable chemistry with semi-aqueous or saponifier technology.

Indium Corporation’s newest jetting solder paste, PicoShot® NC-6M, is a no-clean, halogen-free material specifically formulated to be compatible with Mycronic jetting systems. Chemically compatible with award-winning Indium12.8HF solder paste, PicoShot NC-6M is optimized for small dot jetting and long-term jetting with Type 6 solder paste. PicoShot NC-6M offers the smallest dot jetting volume among similar jetting pastes, at 1.6nL/dot, with a minimum dot size of 230um. In addition to exceptional jetting performance, its unique oxidation barrier promotes complete powder coalescence during reflow to eliminate graping and similar reflow issues.

NC-809 is a halogen-free, ultra-low residue flip-chip flux engineered with high-tack characteristics and designed to hold fine-pitch die or solder spheres in place without risk of shift during the assembly process. NC-809 exhibits superior wetting performance and is the first ULR flux qualified for ball grid array ball-attach applications for packages sensitive to traditional water cleaning processes. NC-809 also improves production yields by eliminating costly cleaning steps, which can increase substrate warpage both after reflow and before the underfilling steps, creating the potential for die damage and cracked solder joints.

NC-702A is a no-clean, near-zero residue, halogen-free, and SVHC-free adhesive solution designed for holding chips, dies, or solder preforms in place to prevent skewing and tilting during placement and reflow processes. Its chemical design enables it to hold a die in place during reflow and evaporate out while formic acid is released to enhance soldering. Its halogen-free nature makes NC-702A environmentally friendly, as well. Its near-zero residue feature also makes it compatible with the subsequent molding or underfill processes without the risk of delamination.

Indium Corporation is also proud to feature its innovative Durafuse® solder technology:

Award-winning Durafuse® LT – a novel solder paste alloy system with highly versatile characteristics that enable energy savings, high reliability, low-temperature, step soldering, assemblies with large temperature gradients, and large BGAs with large complex warpage profiles. Durafuse® HR – based on novel solder paste alloy technology, delivers enhanced thermal cycling performance (-40°C/125°C and -40°C/150°C) and superior voiding performance for high-reliability automotive applications.

Durafuse® HT – a novel design based on a novel alloy technology, designed to deliver a tin-rich, high-temperature, lead-free (HTLF) paste, presenting the merits of both constituent alloys.

Additionally, Indium Corporation will feature QuickSinter®, a new approach to sinter technology. This high-metal, low-organic content approach enables fast drying and sintering times for high throughput, with both silver and copper sinter pastes available.

To learn more about Indium Corporation’s innovative solutions for HIA and SiP, visit our experts at booth #727 at ECTC or online at indium.com/HIA.