Press Releases
CRANSTON, RI – AIM Solder, a global leader in solder assembly materials for the electronics industry, is thrilled to announce the appointment of Katherine Blake as the new Business Development Manager - Automotive. Operating from Belgium, Blake's appointment underscores AIM Solder's commitment to enhancing its strategic initiatives worldwide.
Blake brings a wealth of experience and expertise to AIM Solder, tasked with spearheading the company’s growth and development efforts in the automotive electronics sector. Her role involves forging strong relationships with large multi-site automotive electronics producers globally, ensuring that AIM Solder remains at the forefront of industry trends and customer needs. Her strategic insights and industry knowledge will be crucial in guiding AIM Solder’s efforts to meet both the current and future demands of the automotive electronics marketplace.
“Kate’s understanding of the automotive electronics industry and her ability to align business strategy with customer requirements make her an invaluable addition to the AIM Solder team,” said Andy Dolan, Vice President of Business Development. “Her appointment is a clear reflection of our dedication to serving the automotive market with innovative and reliable solder solutions. We are confident that Kate’s contributions will lead to significant advancements for AIM Solder in this critical sector.”
Katherine Blake can be reached at kblake@aimsolder.com
CRANSTON, RI – AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming Advanced Electronics Assembly Conference taking place on April 24, 2024 at BOK Hall in Budapest, Hungary. AIM Technical Application Engineer, Norbert Labai, will present on the topic: Addressing Concerns of Ultra-Miniature Component Assembly: M0201, 008005, and Micro/MiniLEDs.
Norbert Labai has been in the electronics industry for over 20 years. Mr. Labai supports AIM customers throughout Eastern Europe in solving the most challenging technical issues and adopting the latest application technologies.
The abstract for his presentation is as follows:
The use of ultra-miniature components is driven by the demand for increased functionality in electronic devices. SMT components such as 008004/M0201 are being used in consumer and automotive applications today. Similarly, MiniLED components are finding their way into displays available in the market. Manufacturers are creating new PCB designs, using novel assembly techniques, and introducing innovative materials to overcome the unique challenges faced when implementing these components. This presentation will discuss how to overcome the challenges faced in ultra-miniature component assembly and address the needs of emerging markets.
Mr. Labai will deliver his presentation at the Advanced Electronics Assembly Conference at 10:15 am on April 24. To learn more about AIM’s products and services, visit www.aimsolder.com
CONKLIN, NY – Universal Instruments will showcase a lineup of electronics assembly automation solutions on Booth 2405 at the 2024 IPC APEX EXPO, held at the Anaheim Convention Center on April 9–11. On the booth, Universal will demonstrate its industry benchmark Fuzion® Platform and versatile Uflex® automation platform, as well as its new value-driven Omni™ Inserter. The company’s IQ360™ factory software suite will also be featured.
Fuzion delivers a low cost per placement for any product mix, from traditional to complex PCBA and odd-form to various semiconductor applications. The Fuzion portfolio supports a range of production environments, including extra-capacity (XC) models with up to 272 feeder inputs to support multiple products in NPI and high-speed models with 30-spindle placement heads and up to 66,500 cph.
Uflex accommodates an array of process modules, as well as a wide variety of feeding options to perform virtually any automation task. It supports up to four independent process modules on a single gantry, including vacuum or pneumatic placement, screw driving, UV curing, dispensing, and more.
For more basic automation tasks, the Omni Inserter offers simplified operation and single-process efficiency. It leverages a linear motor positioning system and a host of intelligent features to deliver accurate, high-speed insertion of axial, radial and other odd-form components.
The IQ360 Software Suite is a full complement of smart factory modules designed to control, monitor and improve production efficiency. Comprised of Design & NPI, Material Management, Production Control, and Monitoring & Analytics modules, IQ360 offers individual capability bundles that meet specific factory requirements, providing a true “connected factory” production environment.
“SMT processes are already highly automated, but end-of-line and back-end processes can be predominantly manual and highly inefficient,” said Glenn Farris, Universal Instruments Vice President, Global Customer Operations and Corporate Marketing. “Typical high-volume customers note that these processes account for <5% of total placements but the majority of all rework,” continued Farris. “The key is to alleviate these inefficiencies with intelligent solutions that align with the operators’ level of automation experience. From the basic user to the power user, we offer plug-and-play through highly configurable solutions for complex automation tasks.”
To learn more about Universal’s solutions for any electronics manufacturing challenge, contact Universal Instruments at +1-800-432-2607 or +1-607-779-7522 or visit www.uic.com
CRANSTON, RI – AIM Solder, a global leader in solder assembly materials for the electronics industry, is thrilled to announce the appointment of Sergio Paulo Rodrigues as the new Regional Sales Consultant based in São Paulo, Brazil. In his new role, Rodrigues will focus on expanding AIM Solder’s business in the region and providing unparalleled support to existing customers.
With an impressive background spanning over three decades in the electronics industry and a bachelor’s degree in mechanical engineering, Rodrigues brings a wealth of knowledge and experience to his new position. His expertise will be instrumental in addressing the unique needs of our customers and fostering growth in this vital market.
“We are excited to have Sergio join our team,” said Anderson Albuquerque, Brazil Technical Sales Manager at AIM Solder. “His extensive experience and technical knowledge in the electronics sector make him a perfect fit for AIM Solder. I am confident that Sergio will play a key role in our continued growth and success in Brazil.”
Sergio Paulo Rodrigues can be reached at srodrigues@aimsolder.com
MALDEN, MA – actnano, Inc., a global leader in surface protection technologies for automotive, consumer, and industrial electronics, announced today the closing of a $40 million investment by Anthelion Capital.
actnano’s innovative solutions are trusted globally by leading electronics OEMs and Tier-1 suppliers to provide advanced protection from water and harsh environmental conditions. The company will use the proceeds to continue expanding its technical sales and services footprint as well as to increase production volumes and efficiencies to meet the global demand for their product.
“Our technology outperforms all other electronics protection available in the industry today,” said Taymur Ahmad, CEO of actnano. “Demand for our products has increased significantly because our coatings are safe, non-toxic, and environmentally friendly, and their performance surpasses that of traditional, outdated conformal coatings historically used for electronics protection.”
“It is rare to find a company that has developed technologies which are truly better performing, cost- saving, and more environmentally sustainable compared to top market alternatives,” said Vusal Najafov, Co-Founder, Anthelion Capital. “actnano is a leading innovator in the space, with its customer-driven product development driving rapid scaling within core customers and adoption across multiple new applications and industries such as sustainable energy.”
Anthelion Capital is an investment and data science platform which provides flexible capital solutions to environmentally sustainable companies, seeking cutting-edge solutions that positively impact the environment. Anthelion believes that promoting sustainability, reducing waste, and conserving resources are key steps toward achieving a cleaner environment for future generations.
Previous rounds have included investments from BMW i Ventures, Porsche Ventures, HELLA Ventures, TDK Ventures, Emerald Technology Ventures, GC Ventures America, Henkel Tech Ventures, Ireon Ventures, and Material Impact.
HANAU, GERMANY – Heraeus Electronics is proud to announce that it will host an upcoming ALL2GaN event from April 9- 10, 2024, at its facilities in Hanau. This event will focus on the groundbreaking developments in high-efficiency power electronics, particularly focusing on the capabilities of GaN chips to revolutionize the industry with higher efficiency, power density, and smaller sizes.
Heraeus Electronics is proud to be part of the EU-funded research project “ALL2GaN” (Affordable smart GaN IC solutions for greener applications). This initiative involves 45 partners and aims for a 30% energy efficiency improvement with GaN compared to silicon, contributing to a reduction of 218 million tonnes of CO2 in support of the Green Deal and EU’s 2050 climate neutrality goal.
GaN chips present unique challenges and opportunities for packaging technologies, including significant reductions in bond pad size. At the ALL2GaN event, industry professionals and experts will come together to explore these advancements and their implications. Heraeus Electronics will showcase its latest innovations tailored to meet the demands of miniaturization and high power density required by GaN chips.
During the event, Heraeus Electronics will highlight its Fine Pitch Sinter pastes and an adapted Die Top System/Bonding wires, designed to optimize the performance of GaN chips. The company has already made significant progress in processing GaN semiconductors, with promising results indicating superior shear forces and enhanced robustness with pressure sinter pastes.
Preliminary test results with finer Cu and Al wires have been promising, and prototype samples with small Die Top Systems have been successfully produced. Heraeus Electronics is actively collaborating with customers to refine layout designs, ensuring optimal performance and reliability.
Michael Jörger, Global Head of Business Line Power Electronic Materials, emphasizes the importance of ALL2GaN for Heraeus Electronics, stating, “The participation in such joint projects is one pillar of success in order to develop and introduce innovative materials for power electronics faster and even more successfully.”
For further details and media inquiries about the ALL2GaN event and Heraeus Electronics' role in advancing GaN technology, please contact Manuel Fischer (manuel.fischer@heraeus.com), Press Contact for Heraeus Electronics. Discover more about the ALL2GaN project at the official project website: https://www.all2gan.eu/home
For more information about the ALL2GaN project, please visit the official project website: https://www.all2gan.eu/home
For additional information on Heraeus Electronics and their contributions to semiconductor technology, visit www.heraeus-electronics.com
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