ATLANTA – ECIA is pleased to announce that Adam Osmancevic, VP, Supplier Development of the Global Components business at Arrow Electronics, has joined the Global Industry Practices Committee (GIPC). The GIPC works to identify common global problems and issues, organizes subject matter experts to research, provide guidance and drive adoption to increase efficiencies throughout the global authorized channel for electronic components.

“Adam will be a valuable addition to the very talented team of industry professionals already on our current committee,” Don Elario, ECIA’s VP of Industry Practices added. “Adam began his career in 1995 and he has great experience on the component manufacturer and distribution side of the table. I look forward to working with him to create new efficiencies in the component supply chain.”

REDMOND, WA – Data I/O Corporation (NASDAQ: DAIO), the leading global provider of advanced security and data deployment solutions for microcontrollers, security ICs and memory devices, announced the Company has achieved a major milestone with the sale of the 500 th PSV automated programming system. This milestone is a testament to Data I/O’s continued innovation, investment, and leadership in programming technology for the automotive, industrial and consumer markets and signifies the PSV family as the most successful automated programming system in the industry. Demonstrations of the PSV family will be available in Data I/O’s booth #3107 at the during IPC APEX Expo in Anaheim, California from April 9-11 at the Anaheim Convention Center.

Over the past decade, the PSV family has grown to include the PSV7000, PSV5000, PSV3500, and PSV2800 automated programming systems, which have been further enhanced through the SentriX® security provisioning platform. With system deployments on five continents, and to over one hundred unique customers, the PSV installed base has the capacity to program over 1.5 billion semiconductor devices per year. The strong global demand for the PSV family is reflected in the partnership Data I/O has with its customers and the Company’s continuous innovation strategy to extend the platform to meet its customers’ evolving programming requirements for new device technology, security, and connectivity. As a result, the PSV family is the industry standard for device programming and the trusted supplier to eighteen of the top twenty automotive electronics suppliers worldwide.

“Rapidly changing silicon technology, growing file sizes, increasing security requirements, and the connected smart factory create unique programming challenges for electronics manufacturers, threatening their ability to keep up with production demands. Our customers need a trusted programming platform that can grow and meet their ever-changing requirements. The PSV family helps them address these challenges,” said Anthony Ambrose, President and CEO at Data I/O Corporation. “Data I/O’s dedication to continuous innovation enables our customers to maximize their programming performance to meet these ever- increasing production requirements. Because of our substantial, ongoing investment and our upgrade strategy for PSV systems in the field, customers can leverage their existing Data I/O programming technology for years to come to achieve the lowest total cost of ownership.”

Data I/O to demonstrate the PSV family with security provisioning solutions for the connected factory at the IPC APEX Expo 2024

Data I/O will demonstrate the latest advancements to the PSV7000 and PSV3500 automated programming systems, Lumen®X with VerifyBoost TM , ConneX service software, and SentriX security provisioning platform in Data I/O’s booth #3107 at the IPC APEX Expo at the Anaheim Convention Center from April 9th – April 11th.

Data I/O’s PSV7000 is the premier automated programming solution designed for high-speed scalable production. The PSV3500 offers a cost-effective entry point for customers new to automated programming and is ideal for low volume/high mix production environments.

LumenX with VerifyBoost delivers rapid verify speeds up to 750 MBps for the programming of UFS devices while achieving a 64% improvement in programming performance. The combination of the scalability of the PSV system and LumenX with VerifyBoost maximizes production throughput for customers programming large file sizes and UFS devices.

ConneX service software enables integration between a PSV system and a factory application for two-way communication via MQTT and GraphQL APIs to optimize the electronics manufacturing process and improve quality and traceability. Data I/O will demonstrate the power of ConneX and show how customers can accelerate the integration of the PSV into a factory system by accessing the MQTT and Graph QL sample code on GitHub.

SentriX is the industry’s most flexible security deployment platform for deploying robust hardware-based security for automotive and IoT applications. SentriX simplifies the security provisioning process by delivering pre-defined use cases and custom provisioning flows via SentriX Product Creator. With the addition of new key wrapping capabilities, SentriX now supports even more key management options providing more flexibility to OEMs and electronic manufacturers. The PSV7000 and PSV5000 can be upgraded to support SentriX.

Customers attending the IPC APEX Expo in Anaheim, California can visit Data I/O’s booth in booth #3107 to see these live product demonstrations.

LAKEVILLE, MN – ITW EAE, the Electronic Assembly Equipment division of Illinois Tool Works, announces a new partnership agreement with Foster Innovative Technology, LLC (FIT) to further expand its representation and distribution network. Under this agreement, FIT will now cover the territory of Colorado, Idaho, Oregon, Montana, Utah, Washington, and Wyoming for ITW EAE equipment. This partnership marks an extension of FIT’s existing representation of ITW EAE’s product line, which previously included Oregon, Washington, Montana, and Idaho.

“FIT has provided excellent representation for ITW EAE product lines over the past few years,” said John Fanning, ITW EAE Sales Director. “As we were looking into this expansion, we felt that FIT would be best able to provide our ITW EAE customers with the first class, highly trained and technically experienced sales and support needed to grow our market in this territory. ”With over 25 years of experience serving the electronics assembly market, their mission is to provide world class solutions that are the optimal FIT to the customer application. More information on Foster Innovative Technology, LL (FIT) can be found at https://fitechnologyllc.com.

The recent FIT partnership expansion comes on the heels of retirement of Jeff Howe, AMTI, who represented ITW EAE in the territory for over 40 years.

“I can’t thank Jeff enough for all the experience and guidance as he provided ITW EAE and myself.“ said Marc Apell, ITW EAE Regional Sales Mgr. “Jeff was a mentor to me when I got into the industry and valued his advice.”

CLINTON, NY – Indium Corporation’s Senior Research Metallurgist, Jie Geng, Ph.D., will conduct a webinar on low-voiding, high-reliability, lead-free solder paste for automotive applications. The webinar, part of Indium Corporation’s free InSIDER Series, will be hosted on LinkedIn Live on April 17 at 11 a.m. EST.

Dr. Geng will evaluate a novel lead-free solder paste developed using Indium Corporation’s patented Durafuse® mixed-alloy technology, Durafuse® HR (DFHR). Demonstrating the merits of each constituent solder powder in the paste, DFHR delivers enhanced thermal cycling performance (-40°C/125°C and -40°C/150°C) and superior voiding performance for high-reliability automotive applications.

“Among other features such as versatile compatibility with SAC305 reflow profiles, Durafuse HR shows dramatically improved voiding performance along with high thermal fatigue resistance compared to SAC305 and other high-reliability solder pastes,” said Dr. Geng. “I believe that this technology has the ability to revolutionize automotive soldering processes, and I look forward to sharing this exciting data with my industry colleagues.”

As Senior Research Metallurgist, Dr. Geng leads research projects and works innovatively to deliver timely solutions for both customers and the market. He designs implementation and adjustments of experiments, analyzes the root cause of product failures to create solutions, and trains and leads research associates in laboratory projects. Since joining Indium Corporation in 2016, he has excelled in technology development, as demonstrated by his recent success with Indalloy®292 and Durafuse® HR. Dr. Geng holds a doctorate in metallurgy, a master’s degree in materials science, and a bachelor’s degree in materials science and engineering.

Click here to register for this free and insightful session debuting on LinkedIn Live. The webinar will also be made available for on-demand viewing afterward at indium.com/webinars.