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San Jose, CA — April 2026 — JAVAD EMS (JEMS), a leading global EMS company that provides low to medium volume, high-mix applications, has ordered a new ESPEC EGNZ28-15NW temperature cycling chamber to expand its environmental testing capabilities as demand continues to grow in the military and aerospace sectors.

The chamber supports a temperature range from -70°C to 180°C and faster ramp rates of up to 15°C per minute under load, giving JEMS the ability to meet newer program requirements and shorten overall test cycles.

“We’re seeing more programs that call for tighter testing requirements and increased throughput,” said Gary Walker, President of JAVAD EMS. “This equipment helps us keep pace with those requirements and gives us more flexibility in how we schedule and run tests.”

The ESPEC Global-N chamber offers a temperature range from -70°C to 180°C and a large 28 cubic foot workspace, allowing JEMS to handle complex assemblies and larger builds. Features such as dual-zone airflow, precise temperature control, and a robust refrigeration system support consistent, repeatable test results.

JAVAD EMS focuses on low- to medium-volume, high-mix manufacturing for applications where reliability matters, including aerospace, subsea, satellite, and secure communications. The company supports complex assemblies with capabilities such as fine-pitch and high-density PCBA, along with advanced inspection including 3D solder paste inspection, automated optical inspection, and 3D X-ray.

Adding this chamber strengthens JEMS’ ability to validate products under extreme conditions before they move into the field, while maintaining full traceability throughout the build and test process.

JEMS expects to continue expanding its environmental testing capacity, with plans to add another high-capacity temperature chamber later this year.

For more information, contact JEMS at 408-770-1700, info@javadems.com or visit www.javadems.com.

Byron Center, MI – April 2026 – ubersmt, a U.S.-based electronics manufacturing services provider, has added a full suite of PCB handling equipment from PROMATION to support its growing SMT production line.

The new equipment includes a bare board destacker, magazine unloader, turn conveyor, link conveyors, and a work conveyor—creating a more connected and automated flow from board loading through final handling. Each system is designed to communicate through SMEMA interfaces, allowing boards to move smoothly between processes with minimal manual intervention.

For ubersmt, the investment is less about adding equipment and more about building a line that can run efficiently with a lean team.

“A big part of our model is keeping things simple and efficient,” said Michael Antwih, President and Founder of ubersmt. “If one person can run the line and keep everything moving, that’s a huge advantage. This equipment helps make that possible.”

The destacker allows for continuous loading of bare boards, while the magazine unloader automates end-of-line handling with features like automatic magazine changeover and programmable board spacing. Conveyors—including turn and link systems—connect each stage of the line, maintaining consistent flow and reducing bottlenecks between processes.

By automating PCB handling, ubersmt is able to reduce manual touchpoints, improve consistency, and keep throughput steady—especially important for quick-turn jobs and smaller production runs where efficiency directly impacts cost.

The upgrade also benefits customers by shortening turnaround times and improving overall process control. With fewer manual steps, there is less risk of handling-related errors, and boards move through production more predictably.

Horizon Sales supported the equipment selection and integration, working closely with ubersmt to ensure the systems aligned with the company’s lean manufacturing approach and future growth plans.

ubersmt specializes in quick-turn PCB assembly for startups, entrepreneurs, and low- to medium-volume production. By combining automation with a flexible business model, the company is able to offer U.S.-based manufacturing that remains accessible without sacrificing quality.

For more information, visit www.ubersmt.com.

Brooksville, FL – April 2026 – Interconnect Cable Technologies Corporation (ICTC), a global contract manufacturer, has added in-house parylene coating capability with the installation of a new KR850L system, expanding its value-added services and giving customers a more streamlined path from build to protection.

Bringing this process in-house allows ICTC to reduce lead times, improve scheduling flexibility, and maintain tighter control over quality throughout the manufacturing and finishing process. Customers no longer need to send assemblies out for coating, eliminating an extra step in the supply chain and reducing the risk of handling delays or damage.

“For many of our customers, timing and control matter just as much as the process itself,” said Rob Ogilbee, CFO of ICTC USA. “By keeping coating in-house, we’re able to move faster and keep everything aligned with the rest of the program.”

The addition also allows ICTC to better coordinate coating with its existing inspection and analysis services, creating a more connected workflow. Customers benefit from having testing, failure analysis, and now coating all handled in one place, making it easier to troubleshoot issues, validate performance, and keep programs moving without interruption.

ICTC’s value-added services include dye and pull testing, flying probe testing, microsectioning and cross-section analysis, and salt fog environmental exposure testing. With parylene coating now part of that offering, the company can support a broader range of program requirements without relying on outside vendors.

The new system is already installed and operational, supporting current and upcoming customer programs.

For more information about ICTC’s value-added services, visit https://www.ictcusa.com/what-we-do/value-added-services/.

For more information on ICTC’s manufacturing solutions, visit www.ictcusa.com.

AURORA, CO ― April 2026 ― AdvancedPCB today announced the successful installation of a TruView™ Novus 2D, 2.5D, and 3D X-ray inspection system from Creative Electron, further strengthening its advanced inspection and quality assurance capabilities in its Aurora, CO facility.

The newly installed TruView™ Novus system enables high-resolution inspection of solder joints, hidden connections, and internal structures that cannot be evaluated using traditional optical methods. This advanced capability is critical for ensuring the reliability and performance of today’s high-density, high-reliability electronic assemblies.

Equipped with 2D, 2.5D, and 3D imaging modes, the system delivers exceptional visibility into complex assemblies. Its high-resolution flat panel detector, combined with a 5µm focal spot size, provides up to 1600x magnification, allowing for precise identification of defects such as voiding, misalignment, and insufficient solder fill.

Advanced motion control features enable comprehensive inspection from multiple angles, while CNC mapping automation streamlines workflows and increases inspection efficiency. The system’s intelligent imaging software further enhances contrast and clarity, improving defect detection and analysis.

With the TruView™ Novus now fully operational, AdvancedPCB is well-positioned to support customers across a wide range of industries from aerospace and defense to medical and high-performance computing where precision and reliability are critical.

The investment is part of the company’s 2026 Technology Acceleration Initiative, focused on advancing precision circuit board fabrication and assembly processes to support increasingly complex designs and substrate applications.

For more information, visit www.AdvancedPCB.com.

West Chicago, IL - Anaya Vardya, President and CEO of ASC Sunstone Circuits, a leading provider of printed circuit board (PCB) fabrication and assembly solutions, announced that the company will be exhibiting at PCB East 2026, taking place April 29 at the DCU Convention Center.
PCB East continues to be one of the industry’s most respected events, bringing together PCB designers, engineers, and manufacturers to share ideas, explore new technologies, and collaborate on real-world challenges.

PCB East is where meaningful conversations happen,” said Vardya. “It’s an opportunity for engineers, designers, and manufacturers to come together, solve problems, and move the industry forward. We’re proud to be part of that.”

ASC Sunstone Circuits will be exhibiting at Booth 310.

In addition to exhibiting, ASC Sunstone will be represented in the conference program. Matt Stevenson, Director of Operations, will speak in a technical session titled: “From Idea to In-Hand: A Real-World Journey Through PCB Design, Fabrication, and Assembly.”

Stevenson will be joined by industry experts Vitaly Michalchuk and Geoffrey Hazelett. The session will walk through the full lifecycle of a PCB-from initial concept through design, fabrication, and final assembly-highlighting how collaboration across each stage leads to better outcomes, faster timelines, and higher-quality products.

“Design, fabrication, and assembly don’t work in isolation,” said Stevenson. “When those pieces come together early and stay aligned, everything works better. That’s what we’ll be sharing in this session.”

Attendees visiting ASC Sunstone Circuits at PCB East will learn more about the company’s capabilities, including quick-turn prototyping, advanced fabrication, and integrated assembly services designed to help customers move faster and with more confidence.

About ASC Sunstone Circuits

ASC Sunstone Circuits provides a complete PCB solution—bringing together advanced fabrication, quick-turn prototyping, and integrated assembly services across U.S.-based operations in Illinois and Oregon. The company supports a wide range of industries including medical, aerospace, defense, industrial, and emerging technologies, delivering everything from early-stage prototypes to full production.

With a focus on reliability, speed, and collaboration, ASC Sunstone helps customers move from concept to reality with greater efficiency and confidence. The company holds key certifications including AS9100D, ISO 9001:2015, ISO 13485:2016, MIL-PRF-31032, MIL-PRF-55110, MIL-PRF-50884, and ITAR registration, and offers access to a qualified global supply chain when needed.

For more information, visit www.asc-i.com or www.sunstone.com.

Flying probe testing (FPT) has long been a reliable method for validating PCB designs, particularly for prototypes and low volume production. Unlike traditional in circuit testing (ICT), which relies on custom built fixtures, flying probe systems use movable probes to test electrical connections directly, eliminating the need for dedicated hardware.

What Is Flying Probe Testing?

Flying probe testing uses multiple programmable probes to contact pads, vias, and component leads across a PCB. These probes perform continuity and isolation checks, verify component values, confirm polarity, and test power rails, all without requiring a custom fixture. Instead of redesigning hardware for every iteration, engineers can simply update the test program.

Why Engineers Choose Flying Probe Testing

FPT is especially valuable for designs where fixtures are impractical or uneconomical. It enables testing on dense layouts, high complexity boards, and frequent design revisions without adding unnecessary cost or delay. While slower than ICT, its flexibility makes it ideal for early stage validation and small production runs.

Flying Probe vs In Circuit Testing

Compared to ICT, flying probe testing offers faster setup, lower upfront costs, and greater adaptability to design changes. ICT remains the preferred option for high volume production due to its speed, but FPT provides deeper flexibility and detailed diagnostics when fixtures are not feasible.

Designing for Testability

As PCB designs become more compact and complex, test accessibility becomes a critical challenge. Engineers should plan for testability early by incorporating accessible test points, maintaining adequate spacing, and ensuring probe clearance. Designing with testing in mind helps avoid costly redesigns and ensures reliable validation.

When Flying Probe Isn’t Enough

Although powerful, flying probe testing has limitations. It cannot easily access buried nets, verify high frequency signal integrity, or replicate real world operating conditions. For advanced designs such as RF layouts, rigid flex assemblies, or multi board stacks, a hybrid testing approach combining flying probe testing, AOI, X ray inspection, and functional testing is often required.

A Smarter Approach to PCB Testing

Modern PCB validation relies on combining multiple testing methods to ensure performance and reliability. Flying probe testing plays a key role in this strategy by providing flexible, detailed diagnostics where traditional fixtures fall short.

San Francisco Circuits – Your Trusted PCB Testing Partner

San Francisco Circuits delivers comprehensive PCB testing solutions, including flying probe testing, to support complex designs at every stage of development. Their expertise ensures accurate validation, reduced risk, and high-quality results for even the most challenging applications.

Read more about flying probe testing on San Francisco Circuits’ website.

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