2013 Issues

September 2013 cover

 

FEATURES

NTI-100
The Changing Fab Landscape
The annual list of the largest PCB fabricators reveals big changes coming to Japan and Thailand. But for Brazil, India and the West, it’s more of the same.
by Dr. Hayao Nakahara

CLEANING
Determining Critical Cleaning Process Parameters for QFNs, Part 2
The second part of this two-phase study to assess how to completely clean underneath leadless devices following soldering with Pb-free water soluble and Pb-free no-clean pastes looks at the methodology and results.
by Umut Tosun, Naveen Ravindran and Michael McCutchen

CAPACITY UTILIZATION
Saving on Capex Using Dynamic Capacity Planning
Operations with variability cannot ne run close to 100% loading because queue times become unacceptably high. Thus, management invests in surplus capacity — not to increase throughput, but to keep queue times in check. What is the optimal amount of surplus capacity to purchase, and exactly where? And what is the optimal capital-equipment (capex) purchase plan?
by Bob Kotcher

 

FIRST PERSON

 

MONEY MATTERS

 

TECH TALK

  • On the Forefront
    Joint developments.
    E. Jan Vardaman

  • Final Finishes
    End times for HASL?
    Lenora Toscano

  • Dispensing
    Adhesive application.

    Michael L. Martel

  • Selective Soldering
    Making contact.
    Chris Denney

  • Defects Database
    Too much paste.
    Dr. Chris Hunt

  • Tech Tips
    Yield cause-and-effect.
    Robert Dervaes

  • Getting Lean
    The soft benefits of value engineering.
    Steve McEuen

  • Test and Inspection
    Skunked.
    Robert Boguski

 

August 2013 cover

 

FEATURES

Designer Salary Survey
Better with Age
Our annual survey finds PCB designers are an even more experienced crowd, with concerns about workload, yet increasingly lucrative compensation.
by Chelsey Drysdale

Screen Printing
The Future of Printing Technology
What’s in store? Novel deposition methods, new stencil architectures, “virtual” panelized PCBs, and faster, more highly-utilized print platforms.
by Mark Whitmore

Cleaning
Determining Critical Cleaning Process Parameters for QFNs
Results of a two-phase study aimed at complete cleanliness underneath leadless devices or QFNs, using both lead-free water soluble and lead-free no-clean solder pastes.
by Umut Tosun, Naveen Ravindran and Michael McCutchen

 

FIRST PERSON

 

MONEY MATTERS

 

TECH TALK

  • Screen Printing
    Stencil tension.
    Clive Ashmore

  • Materials World
    Improving hole fill.
    Karl Seelig and Carlos Tafoya

  • Process Doctor
    Scratching the surface.
    Richard Burke

  • Test & Inspection
    Let’s get small.
    Mark Lau

  • Solar Technologies
    A sunny forecast.
    Tom Falcon

July 2013 cover

 

FEATURES

    Stencils
    Analysis of Stencil Tensioning (Elasticity)
    Foil tension variations may create distortion and unpredictable print deposition. An explanation of methods for measuring the tension-elasticity across the foil, and how a novel technology can perform fast, real-time mapping of stencil characteristics.
    by Ricky Bennett, Ph.D., and Richard Lieske

    Reliability
    The Role of Failure-Oriented-Accelerated-Testing for Field Functional IC Packages
    Devices are known to pass qualification testing, then fail in the field. Does that suggest the test specifications are inadequate?
    by Ephraim Suhir, Ph.D.

    Defects Database
    Trim Those Whiskers
    The speed of dendrite formation depends on the material, voltage applied and separation distance between terminations. This is the case in a normal failure but is also exaggerated by the level of surface moisture.
    by Dr. Chris Hunt

 

FIRST PERSON

MONEY MATTERS

  • ROI
    Talent over tools.
    Peter Bigelow

 

TECH TALK

 

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