2013 Issues

June 2013 cover

 

FEATURES

    Data Transfer
    IPC-2581 Consortium Update
    The consortium is on track to extend the standard to enable build-intent collaboration between PCB manufacturers and design houses before layout begins.
    by Hemant Shah

    Component Placement
    The Impact of Reel Splicing Kits on Setup and Changeover
    Everything from resistors to BGAs to odd-form components is packaged in tape-and-reel. Splicing kits can dramatically improve reel setup and changeover efficiencies.
    by Rob Sierra

    Markets
    Outsourcing at Home
    OEMs are cutting time in new product development to maintain a competitive advantage. Aided by grants and better internal execution, some smaller EMS companies are taking advantage.
    by John Sammut

    ESD
    Static Control Standards: An Annual Progress Report
    From components to wrist straps, a look at more than 60 documents that make up ESD control programs.
    by  The ESD Association

    Supply Chain
    An Onshore Wind
    Changing economics is moving contract assembly to North America. Here’s why.
    by Robert Sergio Simon

    European RoHS Enforcement Explained
    An Onshore Wind
    A UK-based expert on implementation and enforcement details the latest round of changes, and what we can expect in the future.
    by Mike Buetow

 

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TECH TALK

 

May 2013 cover

 

FEATURES

    SIR Testing
    The IPC-B-52 SIR Test Vehicle: Current Test Vehicle Design and Possible Modifications
    IPC-B-52 is not always seen as adequately “product-like.” Alternate test vehicle designs offer the flexibility to make it so.
    by Mitchell Ferrill, Matt Kelly, Wai Ma, Nandu Ranadive, Cheikhou Ndiaye, Jim Bielick and Simin Bagheri

    Inspection
    First Article Verification: A New Level of Accuracy
    Impedance checking boosts FAI's value.
    by Matthew Holzmann and Chrys Shea

    Component Qualification
    Fine-Tuning Acoustic Screening of PEMs
    Picking the right standard means knowing the spec and what it is that needs testing.
    by Tom Adams

    Materials World
    Flip-Chip Devices Get Flat
    Thin is in, but what modern flip chip devices really need is to be flat.
    by Jie Bai

 

FIRST PERSON

MONEY MATTERS

  • ROI
    Rigid-flex.
    Peter Bigelow

 

TECH TALK

 

April 2013 cover

 

FEATURES

    COVER STORY
    SMT Reflow Oven-to-Oven Repeatability
    SMT process engineers with multiple process lines traditionally needed to establish a different recipe for each reflow oven because of variation between equipment. Advancements now make it possible to adjust some reflow ovens so a single recipe will work “among” ovens running the same product.
    by Fred Dimock

    EMS Top 50
    Bend, Don’t Break
    If the EMS market in 2012 were a movie, it would have been the good (Nam Tai), the bad (the effects of RIM) and the ugly (Elcoteq). But most of the world’s 50 largest contract assemblers absorbed the blows from shrinking PC and cellphone margins and set their sights on the more profitable (if smaller) automotive and industrial sectors.
    by Mike Buetow

    Nanocoatings
    Stencil Printing: The Next Big Thing is Actually Very Small
    Originally met with overt industry skepticism, nanocoatings are quickly proving themselves in studies and in production. A look at the latest in the molecule technology.
    by Chrys Shea

    ESD Basics
    Managing Your ESD Program
    Enjoy all the software tools, but don’t forget the procedures.
    by The ESD Association

    Pan Pac Recap
    High-Tech in Hawaii
    The annual Pan Pacific Microelectronics Symposium brought together the industry’s top specialists from around the world, and process and equipment revelations were in abundance.
    by Chrys Shea

 

FIRST PERSON

MONEY MATTERS

  • ROI
    Incorporating new technology.
    Peter Bigelow

  • Focus on Business
    Relationship make or breaks.
    Susan Mucha

 

TECH TALK

 

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