2013 Issues

March 2013 cover

 

FEATURES

    Apex Expo Recap
    Let’s Get Small
    At IPC Apex Expo this year, small was big. Benchtop was in and integration was all the rage at the annual North American trade show.
    by Mike Buetow

    Cover Story
    Bridging Technology between Conventional 3D and TSV 3D Stacking
    Two new multi-die DRAM packages have thin profiles and minimize wirebond length.
    by Belgacem Haba, Ph.D.

    SMT Automation
    Robotics Assembly from Prototype to Production
    Behind every robot is the manufacturing assembly process of how the robot was built. Here, the author details some key areas of the Benchmark Electronics’ Robotics manufacturing process, from a prototype or new-build stage to steady-state production.
    by Scott Mazur

 

FIRST PERSON

 

MONEY MATTERS

  • ROI
    I will, I promise.
    Peter Bigelow

 

TECH TALK

 

February 2013 cover

 

FEATURES

    Cover Story
    Lead-Free Assembly Design for Manufacturability Considerations
    The changeover to lead-free has brought with it serious implications for many key design rules. A look at the system-level management requirements and key DfM elements shown to improve overall yield, quality and reliability of high-complexity, high-reliability hardware.
    by Matt Kelly and Mark Hoffmeyer, PH.D.

    Factory Layout
    ‘U Turn’
    How one EMS company slashed production time by half by switching from a straight line flow to a “U” shaped layout.
    by Per Jennel

    Quality Assurance
    Availability Index and Minimized Reliability Costs
    A model for quantifying how the total cost of improving and maintaining reliability can be minimized, and the relationship of that minimized cost to the availability index.
    by Ephraim Suhir, Ph.D., and Laurent Bechou, PH.D.

    ESD Basics
    How Much Protection Is Enough?
    Five questions to ask concerning ESD protection.
    by The ESD Association

 

FIRST PERSON

 

MONEY MATTERS

  • ROI
    The great equalizer.
    Peter Bigelow

  • Focus on Business
    Evaluating technology improvements.
    Susan Mucha

 

TECH TALK

 

January 2013 cover

 

FEATURES

    RoHS Compliance
    Can RoHS Conversion Actually Reduce Product Cost?
    he initial conversion of consumer and other electronics to RoHS was painful and costly at all levels of the supply chain. But over the past six years, many valuable lessons have been learned that can ease the coming transition for the next wave of products pursuing compliance, not to mention older designs that need to be updated. A look at the keys to a successful, economically advantageous conversion.
    by Philip DiVita, David Steele, John Kanavel and Chrys Shea

 

FIRST PERSON

 

TECH TALK

 

Page 4 of 4