Circuits Assembly February 2010 cover

FEATURES

  • DfA
    Component Layout in Placement Processes
    Effective, accurate component placement takes into account the best practices of design and assembly, both of them inextricably intertwined. Positioning CSPs and noise-sensitive devices are two of a host of considerations.
    by Zulki Khan

  • Component Lead Prep
    A Novel Process for Automated Lead Tinning
    Tin whisker formation associated with Sn99 finishes and other assembly solder defects are being seen by many companies due to the faster oxidation rates of Sn99 component finishes. Such parts can now be rapidly de-taped, tinned, cleaned and re-taped via new equipment and processes.
    by Richard Stadem and Cornel Cristea

  • Zestron Corp.
    Closing the Cleaning Gap
    The switch to Pb-free solders and more densely packed boards that effectively turn even trace residues from aesthetic nuisances into potential hazards has brought about a renaissance for cleaning advocates. A trip through Zestron’s tech center outside Munich reveals a company dedicated to fixing these process problems.
    by Mike Buetow

  • Soldering Optimization
    Wave Solder Thermal Profiling
    Knowing how to set the temperatures in soldering can ease the occurrence of board failures.
    by Francisco Anaya

FIRST PERSON

  • Caveat Lector
    Testing our mettle.
    Mike Buetow
  • Sherman's Market
    Riding the EMS rollercoaster.
    Randall Sherman

  • Talking Heads
    Assembléon CEO André Papoular: still up for the challenge.
    Mike Buetow

MONEY MATTERS

  • Global Sourcing
    When offshoring works best.
    Rob Duvall

  • ROI
    Back to basics.
    Peter Bigelow

TECH TALK

  • EMC for the Real World
    Grover on inductance.
    Dr. Eric Bogatin

  • Screen Printing
    Registration using closed-loop control.
    Dr. Rita Mohanty

  • Wave Soldering
    Applying gauge R&R for soldering optimization.
    Dr. Ursula Marquez de Tino

  • Wave Soldering Troubleshooting
    Rough or disturbed solder.
    Paul Lotosky

  • The Defects Database
    Rethinking black pad.
    Dr. Davide Di Maio, Ph.D.

  • Test and Inspection
    IEEE test standards 'speed' toward resolution.
    Jun Balangue

  • Tech Tips
    Halide fluxes' corrosive effects.
    ACI Technologies Inc.

  • Getting Lean
    Sequentially implementing Lean and Lean Sigma.
    Carlos Rodriguez

  • Technical Abstracts
    In case you missed it.

 

DEPARTMENTS

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