Circuits Assembly March 2010 cover

FEATURES

  • Cover Story
    Could Printed Electronics Replace Traditional Electronics?
    Over the next 10 years, printed electronics will make gains in RFID, displays, packaging, ICs, and alternative energy. But a glorious future isn't set in stone.
    by Randall Sherman

  • CIRCUITS ASSEMBLY Top 50
    The Trials of 2009
    When it comes time to write the story of the EMS industry in 2009, foremost will be the effects of the recession. The subtext, however, will be the dramatic fall of Elcoteq, whose final chapter is still being written. Plus: The 50 largest EMS companies.
    by Mike Buetow

  • Supply Chain Management
    Ensuring Component Integrity from an EMS Perspective
    Short consumer product lifecycles, the electronics industry’s conversion to lead-free components, and general weakness in the global market have increased the speed at which components are becoming obsolete. And legacy products are prone to fake parts.
    by Dennis Gradler

  • 3-D AOI
    Improving Solder Paste Printing through Phase Shift Interferometry
    New measurement technology enables high degrees of verification and confidence.
    by Chrys Shea

FIRST PERSON

  • Caveat Lector
    Tin drums beat louder.
    Mike Buetow
  • Talking Heads
    Orpro Vision is looking good.
    Mike Buetow

MONEY MATTERS

  • Global Sourcing
    Getting vertical.
    Rex Green

  • ROI
    Merger mania strikes again.
    Peter Bigelow

TECH TALK

  • On the Forefront
    Can Japan stay committed to R&D?
    E. Jan Vardaman

  • Screen Printing
    Registration using closed-loop control.
    Dr. Rita Mohanty

  • Selective Soldering
    The yes/no decision on nitrogen.
    Al Cable

  • Wave Soldering Troubleshooting
    Mitigating grainy or dull solder.
    Paul Lotosky

  • The Defects Database
    Paste stuck in stencil apertures.
    Dr. Davide Di Maio, Ph.D.

  • Process Doctor
    Our standard plea.
    Dr. Harald Wack

  • Materials World
    How "free" is halogen-free solder?
    Jie Bai

  • Tech Tips
    Component reliability for RF applications.
    ACI Technologies Inc.

  • Solar Technologies
    Frontside silver conductor line efficiency.
    Tom Falcon

  • Technical Abstracts
    In case you missed it.

 

DEPARTMENTS

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