2010 Issues

Circuits Assembly March 2010 cover

FEATURES

  • Cover Story
    Could Printed Electronics Replace Traditional Electronics?
    Over the next 10 years, printed electronics will make gains in RFID, displays, packaging, ICs, and alternative energy. But a glorious future isn't set in stone.
    by Randall Sherman

  • CIRCUITS ASSEMBLY Top 50
    The Trials of 2009
    When it comes time to write the story of the EMS industry in 2009, foremost will be the effects of the recession. The subtext, however, will be the dramatic fall of Elcoteq, whose final chapter is still being written. Plus: The 50 largest EMS companies.
    by Mike Buetow

  • Supply Chain Management
    Ensuring Component Integrity from an EMS Perspective
    Short consumer product lifecycles, the electronics industry’s conversion to lead-free components, and general weakness in the global market have increased the speed at which components are becoming obsolete. And legacy products are prone to fake parts.
    by Dennis Gradler

  • 3-D AOI
    Improving Solder Paste Printing through Phase Shift Interferometry
    New measurement technology enables high degrees of verification and confidence.
    by Chrys Shea

FIRST PERSON

  • Caveat Lector
    Tin drums beat louder.
    Mike Buetow
  • Talking Heads
    Orpro Vision is looking good.
    Mike Buetow

MONEY MATTERS

  • Global Sourcing
    Getting vertical.
    Rex Green

  • ROI
    Merger mania strikes again.
    Peter Bigelow

TECH TALK

  • On the Forefront
    Can Japan stay committed to R&D?
    E. Jan Vardaman

  • Screen Printing
    Registration using closed-loop control.
    Dr. Rita Mohanty

  • Selective Soldering
    The yes/no decision on nitrogen.
    Al Cable

  • Wave Soldering Troubleshooting
    Mitigating grainy or dull solder.
    Paul Lotosky

  • The Defects Database
    Paste stuck in stencil apertures.
    Dr. Davide Di Maio, Ph.D.

  • Process Doctor
    Our standard plea.
    Dr. Harald Wack

  • Materials World
    How "free" is halogen-free solder?
    Jie Bai

  • Tech Tips
    Component reliability for RF applications.
    ACI Technologies Inc.

  • Solar Technologies
    Frontside silver conductor line efficiency.
    Tom Falcon

  • Technical Abstracts
    In case you missed it.

 

DEPARTMENTS

Off the Shelf

Circuits Assembly February 2010 cover

FEATURES

  • DfA
    Component Layout in Placement Processes
    Effective, accurate component placement takes into account the best practices of design and assembly, both of them inextricably intertwined. Positioning CSPs and noise-sensitive devices are two of a host of considerations.
    by Zulki Khan

  • Component Lead Prep
    A Novel Process for Automated Lead Tinning
    Tin whisker formation associated with Sn99 finishes and other assembly solder defects are being seen by many companies due to the faster oxidation rates of Sn99 component finishes. Such parts can now be rapidly de-taped, tinned, cleaned and re-taped via new equipment and processes.
    by Richard Stadem and Cornel Cristea

  • Zestron Corp.
    Closing the Cleaning Gap
    The switch to Pb-free solders and more densely packed boards that effectively turn even trace residues from aesthetic nuisances into potential hazards has brought about a renaissance for cleaning advocates. A trip through Zestron’s tech center outside Munich reveals a company dedicated to fixing these process problems.
    by Mike Buetow

  • Soldering Optimization
    Wave Solder Thermal Profiling
    Knowing how to set the temperatures in soldering can ease the occurrence of board failures.
    by Francisco Anaya

FIRST PERSON

  • Caveat Lector
    Testing our mettle.
    Mike Buetow
  • Sherman's Market
    Riding the EMS rollercoaster.
    Randall Sherman

  • Talking Heads
    Assembléon CEO André Papoular: still up for the challenge.
    Mike Buetow

MONEY MATTERS

  • Global Sourcing
    When offshoring works best.
    Rob Duvall

  • ROI
    Back to basics.
    Peter Bigelow

TECH TALK

  • EMC for the Real World
    Grover on inductance.
    Dr. Eric Bogatin

  • Screen Printing
    Registration using closed-loop control.
    Dr. Rita Mohanty

  • Wave Soldering
    Applying gauge R&R for soldering optimization.
    Dr. Ursula Marquez de Tino

  • Wave Soldering Troubleshooting
    Rough or disturbed solder.
    Paul Lotosky

  • The Defects Database
    Rethinking black pad.
    Dr. Davide Di Maio, Ph.D.

  • Test and Inspection
    IEEE test standards 'speed' toward resolution.
    Jun Balangue

  • Tech Tips
    Halide fluxes' corrosive effects.
    ACI Technologies Inc.

  • Getting Lean
    Sequentially implementing Lean and Lean Sigma.
    Carlos Rodriguez

  • Technical Abstracts
    In case you missed it.

 

DEPARTMENTS

Off the Shelf

Circuits Assembly January 2010 cover

FEATURES

  • Productronica Recap
    Trading Up
    For the first time in 10 years, we saw the sun in Munich. Is it a sign of a new dawn for the industry? OK, no, but amid tepid expectations, Productronica turned out stronger than expected, again defying gravity and the pundits to remain the mother of all trade shows.
    by Mike Buetow

  • CAM
    Improving Fabrication Yields
    A large portion of manufacturing yield is tied up in the CAM process, and these "fabrication planners" can make the difference between profits and losses. Plus: The designer's role.
    by Zulki Khan

  • X-Ray Inspection
    X-Ray Imaging of Pb-Free Solder Joints
    Inspecting Pb-free solder joints requires consideration be given to the implications of the material differences exhibited by the elements present to ensure that optimal image quality is maintained. When optimizing the tube, the actual adjustments are highly dependent on the thickness and mass of the solder joint for various components.
    by Dr. Evstatin Krastev

FIRST PERSON

  • Caveat Lector
    "Conflict metals" fight deepens.
    Mike Buetow
  • Talking Heads
    CyberOptics' Kitty Iverson.
    Mike Buetow

MONEY MATTERS

  • Focus on Business
    Hiring's golden age.
    Susan Mucha

TECH TALK

  • On the Forefront
    Potential derailments.
    E. Jan Vardaman

  • Better Manufacturing
    Improving test coverage by design.
    Andrew Murrietta

  • Screen Printing
    Embedded passives: nothing but a win.
    Clive Ashmore

  • Selective Soldering
    Defect-free selective soldering.
    Ursula Marquez de Tino, Ph.D.

  • Wave Soldering Troubleshooting
    Solder on the mask.
    Paul Lotosky

  • The Defects Database
    Plating-related opens.
    Dr. Davide Di Maio, Ph.D.

  • Process Doctor
    Debunking subjective cleanliness assessments.
    Harald Wack, Ph.D.

  • Materials World
    Type 4 solder standards.
    Jie Bai

  • Solar Technologies
    Solar Power International was a return to the past.
    Chrys Shea

  • Tech Tips
    Boundary scan extends its use.
    ACI Technologies Inc.

  • Technical Abstracts
    In case you missed it.

 

DEPARTMENTS

Off the Shelf

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