March 2007 cover

March 2007 CA TOC

FEATURES

  • INEMI Roadmap
    Converging Products, Expanding Supply Chain
    The “iNEMI Roadmap 2007” edition, available this month, provides a more global perspective than any previous version, with representation from all major regions. Here, future research, development and implementation needs are identified.
    Jim McElroy

  • Wave Solder Fluxes
    Wave Soldering Flux Selection for Pb-Free Assembly
    Both the manufacturing and end-use environments play big roles in flux selection. A look at the design, process and reliability implications of each major type of flux.
    Chrys Shea, Sanju Arora and Steve Brown

  • Lean Manufacturing
    Effective Lean Six Sigma Deployment in a Global EMS Environment
    The fusion of Lean Six Sigma has achieved results more effectively and efficiently than either quality program does alone. Here’s how to avoid the most frequent cause of failure: putting it into practice.
    Dr. Harjinder Ladhar

  • Cover Story
    Quickturn BGA Reballing
    A new, quickturn technique for reinstalling balls on “BGA” components relies on laser-cut polyimide stencils and fixtures, and is designed to place new solder balls onto array-style components in small volumes (fewer than 100 devices).
    Bob Wettermann

FIRST PERSON

  • Caveat Lector
    Machine software is the next big thing.
    Mike Buetow

MONEY MATTERS

TECH TALK

DEPARTMENTS

Industry News
Market Watch
Assembly Insider
Ad Index
SMT/Hybrid/Packaging and Nepcon China Product Previews

On the cover: Balls are re-soldered onto a grid array. (Photo courtesy Cookson BEST)

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