iNEMI 2007 Roadmap
Organic and Printed Electronics: The Next Big Thing?
A wave of new functional electronic inks and printing platforms are poised to cut costs and speed throughput. Are these materials and methodologies ready for prime time?
Daniel Gamota and Jie Zhang
Microvia-in-Pad: Possible Outcomes and Solutions
The smaller and lighter, the better, right? But one solution for electronics anorexia – microvias-in-pad – is prone to voiding and should be integrated cautiously. This study found via filling a cost-effective solution.
Outsourcing PCB Design
The PCB Design Outsource Proposition
OEMs are looking outside for design partners. What options do designers have for surviving in an outsourced world?
A Novel Low Melting Point Pb-Free Solder
A SnBiX solder showed a melting point of about 186°C and cut the material cost; mechanical tests suggest its drop-in replacement potential.
Yuanshan Li, Xiaojuan Lei and Zhenhua Chen
Solder Joint Reliability
Factors Affecting Voiding in Pb-free Solder Joints
A study of solder materials and PCB finishes finds copper and certain flux formulations to blame for high voiding levels.
Dr. G.J. Jackson and Dr. H.A.H. Steen
A Mixed Technology Reliability Assessment
In an investigation of potential Pb-free component reliability problems, a major medical OEM learns some surprises about the failure mechanisms of SAC and SnPb eutectic solders.
Dr. Lucian Kasprzak, Milind Sawant, Gerry Adams, Brian Lewis, Paul N. Houston, Dr. Daniel Baldwin and Mike Nahorniak
Extending Tip Life in Pb-Free Hand Soldering
Pb-free solder joints form at higher temperatures than do SnPb joints, but hand iron temperatures need not be raised. Improved heater control techniques can eliminate temperature overshoot, improve thermal transfer and reduce idle temperature.
Optimizing Paste Deposits
Mathematical Modeling of Solder Paste Stenciling for Process Control
A DoE for characterizing solder paste stencil printing and measuring paste bricks by 3-D AOI verified a mathematical model for predicting volume and standard deviation of printed paste volume for all package styles.
Pb-Free Wave Solder Design Guidelines
Because basic wetting and flow behaviors of alloys used in the process are changing, guidelines for everything from pad design to lead length should be reviewed.
Dale Lee and Denis Jean
Harsh Environment Reliability
Conformal Coating and Board Cleanliness
A rundown of the major coating types and application methods.
Bryan Gillespie and Matt DeBenedetto
The hardest sell.
CTS’s Ron Bell.
Who’s your customer?
Focus on Business
Process mapping lessons.
Dr. Jonathan Linton
Not all XRFs are created equal.
Different cultures, same problems.
Underfill and BGAs.
American Competitiveness Institute
Spouting off on blowholes.
Pb-Free Lessons Learned
Truths about Pb-free wave soldering.
Those who forget the (near) past ...
Eliminating dendritic growth.
Vitronics’ XPM3 reflow oven.
Apex Product Preview
On the cover: Limiting microvias’ contribution to void formation. (Photos courtesy Cookson Electronics)