Fraunhofer IZM to Present iNEMI Webinar on FOWLP
Published: 04 January 2017
by Chelsey Drysdale
BERLIN – iNEMI will host a webinar on fan-out wafer level packaging on Jan. 12.
Fraunhofer IZM will discuss moving to larger form factors for manufacture of fan-out wafer level packaging.
Tanja Braun, PhD, will provide a detailed discussion of the state of technology for panel level packaging. Braun heads the Assembly & Encapsulation Technologies group for Fraunhofer IZM.
For more information and to register, visit http://community.inemi.org/ev_calendar_day.asp?date=10/25/2016&eventid=81.
