Jedec Updates Microelectronic Packages, Covers Standard
ARLINGTON, VA – Jedec has published a revision to Inspection Criteria for Microelectronic Packages and Covers (JESD9B).
The purpose of this standard is to verify the workmanship and requirements of microelectronic packages and covers (lids) intended for use in fabricating hybrid microelectronic circuits/microcircuits.
JESD9B supersedes and incorporates a complete rewrite of JESD27, Ceramic Package Specification for Microelectronic Packages. It also includes pertinent areas of MIL-STD-883 and Test Method 2009: External Visual, and is meant to be used in conjunction with these standards.
It incorporates new criteria and updates old criteria based on advancements in the packaging industry and user failure modes history. The standard includes color photos or diagrams for every condition listed.
The free standard may be downloaded here: http://www.jedec.org/standards-documents/results/jesd9b.
