OXFORDSHIRE, ENGLAND – The Smart Area Array Reliability Conference and Table Top Exhibition will be held here Oct. 5 and 6.

Topics include industry trends on area array packaging; design and reliability of BGA and uBGA devices; soldering and joint reliability of lead-free and mixed alloys; ductility of lead-free solder balls; underfill vs. corner bumping; pad cratering on laminates; design for cleaning electronics assemblies; no-clean vs. clean; aqueous, semiaqueous and solvent choices; demonstrating area array cleaning reliability; coating and its impact of joint reliability; coating under BGA; and tin whiskers and benefits from coating.

For more information, visit www.smartgroup.org.

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