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iSpector desktop automated optical inspection offers one top camera and eight side cameras in 45/45° configuration. Solder joints of 45° circuitry designs can be inspected with 10µm resolution side cameras. Combines simultaneous nine camera inspection, 24-bit color imaging technology, and 3D solder meniscus profiling. 

Mek Europe BV, www.mek-europe.com

5K Spectro, for printed circuit boards automated optical inspection, uses a 12-bit color camera, reportedly delivering 16x the information provided by an 8-bit camera. An advanced GPU provides pre-processed images to the Core i7 PC. Incorporates a high-intensity programmable broadband lighting system.

Vi Technology, www.vitechnology.com

2K Perform is a compact AOI designed to handle small- to medium-sized printed circuit boards. Offers 14" x 14" board capability at the same performance levels as the 3K, 5K and 7K series. Uses P series acquisition head, including i-Lite illumination system. Applications include 2D SPI, mixed mode inspection, closed loop enabled by pre-reflow inspection, post-reflow inspection, off-line programming, versatile repair strategies, embedded and external SPC tools, and VieWeb data reporting solutions.  

Vi Technology, www.vitechnology.com

Vision 20 AOI/SPI software suite provides defect detection from 2D SPI through pre- and post-reflow and post-wave applications. Is for low-volume/high-mix production. Features offline programming capability, including program tuning. Resolution reportedly handles 01005 components.

Vi Technology, www.vitechnology.com

SMD Tower 513 XL is an automated and expandable buffer storage unit designed for near-production deployment. Ensures correct component remains stored in the correct place and in a controlled atmosphere. Is optimized for high-volume manufacturing and provides 70% more space for large reels in the same 1 m2 footprint as Tower 200. Can store up to 336 13" reels and 600 trays. Is MSD-compliant.

Mydata, www.mydata.com

A dummy version of Amkor’s CVBGA is available. The 0.3mm CVBGA is a 8x8mm, 368, 0.30mm solder ball pitch, two-layer thin core substrate with an Ni/Au BGA finish that uses a HL832NX-A (60 µm core) and AUS 410 solder mask. Is reportedly ideal to train, test and qualify. Is identical to the live package, without the IC die inside.

Practical Components, www.practicalcomponents.com

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